Planar RF Sensor PCB Core Ring Magnetic Flux
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Solution Overview
Problem
Radio frequency (RF) voltage/current (VI) probes experience interference due to parasitic resonance and low frequency coupling, which affects their performance in applications like semiconductor manufacturing and micromachining.
Innovation Solution
The design incorporates a printed circuit board (PCB) with multiple conductive layers, including a core ring embedded between sensor pads and vias to increase magnetic flux, and strategically arranged current and voltage sensor pads to enhance magnetic and capacitive coupling, reducing interference and improving dynamic range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional RF voltage/current probes are used, then the device structure is simple, but parasitic resonance and low frequency coupling interference occur affecting measurement accuracy
Solution Approach 1:
A magnetic core is introduced as an intermediary element between the RF signal and the sensor probes. The magnetic core concentrates and guides the magnetic flux, serving as a mediator that enhances the magnetic coupling between the RF conductor and the voltage/current sensor pads while preventing direct electromagnetic interference and parasitic resonance effects on the measurement system
Solution Approach 2:
The invention transitions from traditional planar probe designs to a three-dimensional configuration by positioning sensor pads on opposite sides of a PCB with a magnetic core in between. This spatial arrangement in multiple dimensions creates distinct magnetic coupling paths that reduce parasitic resonance and improve measurement accuracy by separating the sensing elements from direct electromagnetic interference zones
2Adaptability or versatility
If traditional probe design is used, then manufacturing is simple, but dynamic range and frequency response are limited
Solution Approach 1:
The PCB structure serves multiple functions simultaneously: it provides mechanical support for the sensor pads, acts as an insulating barrier between voltage and current sensing elements, and works in conjunction with the magnetic core to enhance magnetic coupling. This multi-functional design improves frequency response and dynamic range while managing the inherent complexity through integrated design
3Measurement precision
If sensor pads are placed close to the center conductor, then magnetic coupling is enhanced, but capacitive coupling interference increases
Solution Approach 1:
The magnetic core acts as an intermediary that strengthens magnetic coupling between the center conductor and sensor pads while the PCB material serves as an intermediary barrier that reduces capacitive coupling interference. This dual intermediary approach allows close placement of sensor pads for enhanced sensitivity without suffering from capacitive interference
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the frequency response and dynamic range of the VI probe, reducing interference and maintaining accurate signal measurement across various frequencies.
Implementation Method 1
a core ring embedded between sensor pads and vias to increase magnetic flux
Implementation Method 2
strategically arranged current and voltage sensor pads to enhance magnetic and capacitive coupling
Implementation Method 3
a first plurality of sensor pads coupled to a first plurality of vias by a first plurality of traces
Data Source
AI summary
A radio frequency sensor system includes a printed circuit board (PCB). The PCB includes a first exterior layer, a second exterior layer, a first interior layer, a second interior layer, and an inner perimeter that defines an aperture through the PCB. The PCB also includes a first loop. The first loop includes a first plurality of sensor pads coupled to a first plurality of vias by a first plurality of traces. The first plurality of sensor pads is arranged on the inner perimeter. The PCB also includes a second loop. The second loop includes a second plurality of sensor pads coupled to a second plurality of vias by a second plurality of traces. The second plurality of sensor pads is arranged on the inner perimeter. A core ring is embedded within the first interior layer proximal to the first plurality of sensor pads, the first plurality of vias, and the first plurality of traces. A center conductor, for carrying RF current, extends through the aperture. The first and second loops generate an electrical signal based on the first and second plurality of sensor pads, the first and second plurality of vias, the first and second plurality of traces, and the core ring.