RF Voltage and Current Sensor Assembly for Precise Plasma Metrology

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Solution Overview

Problem

Current plasma processing systems for semiconductor IC fabrication face challenges in achieving precise control of RF signals due to the lack of accurate and unobtrusive metrology for RF voltage and current measurements, which affects the precision and repeatability of plasma processes, especially at the atomic scale dimensions required for advanced IC designs.

Innovation Solution

The development of a radio frequency (RF) sensor assembly with a sensor casing and cavity design that includes a dielectric material, a current sensor with a conductive ridge and toroidal mandrel, and a voltage sensor with a ring-shaped pickup, allowing for precise measurement of voltage, current, and phase angle of RF signals with minimal disturbance to the plasma process, enabling improved control and repeatability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional RF measurement methods are used, then measurement capability is provided, but measurement precision and accuracy are insufficient for atomic scale plasma control

Engineering Contradiction:
ImproveRF voltage and current measurement precisionVSAvoidplasma process control precision
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

The patent introduces an intermediary RF sensor assembly that couples to the RF signal without directly interfering with the plasma process. The sensor uses a pickup electrode and coupling capacitor to indirectly measure RF voltage and current, acting as a mediator between the plasma environment and measurement instrumentation. This intermediary approach enables precise measurements while maintaining plasma process integrity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces direct mechanical/probe-based measurement methods with an electromagnetic field-based sensing system. The RF sensor assembly uses electromagnetic coupling through capacitive and inductive elements to measure RF parameters, substituting physical contact methods with field-based measurement. This substitution reduces measurement intrusion and improves precision for atomic scale plasma control.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Measurement precision

If RF sensors are introduced to improve measurement accuracy, then measurement capability is enhanced, but device complexity increases

Engineering Contradiction:
ImproveRF signal measurement accuracyVSAvoidsensor assembly complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The RF sensor assembly is designed to perform multiple measurement functions (voltage, current, phase angle) using a single integrated device. The sensor can measure different RF parameters by configuring which electrodes are active, eliminating the need for separate sensors for each measurement type. This multi-functionality reduces overall system complexity while maintaining high measurement precision.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines voltage sensing and current sensing capabilities into a single RF sensor assembly. The pickup electrode and sense electrode work together within one housing, sharing common components like the coupling capacitor and impedance matching circuitry. This merging of functions reduces the number of separate devices needed and simplifies the overall measurement system.

Inventive Principle:
Principle #5Merging (Combining)

3Device complexity

If conventional measurement approaches are used, then simplicity is maintained, but measurement disturbance to plasma process increases

Engineering Contradiction:
Improvesensor design simplicityVSAvoidplasma process disturbance
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the measurement function from the main plasma processing system by using a separate, externally coupled RF sensor assembly. The sensor is positioned to couple with RF signals without being physically immersed in the plasma, separating the measurement apparatus from the plasma environment. This extraction minimizes plasma disturbance while maintaining measurement capability.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The RF sensor assembly uses thin dielectric layers and flexible coupling structures to interface with RF signals. The coupling capacitor and impedance matching network use thin-film techniques to create minimal physical presence in the RF path. This approach maintains measurement simplicity while reducing plasma process disturbance through minimalistic sensor construction.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The RF sensor assembly provides high-precision measurements of RF signals, enhancing the control and repeatability of plasma processes without increasing costs, allowing for better plasma processing systems that maintain precision at the atomic scale dimensions needed for advanced IC designs.

Implementation Method 1

a current sensor electrically insulated from the sensor casing and including a current pickup disposed symmetrically around the central hole

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

a cavity disposed around the central hole and including a dielectric material, the cavity being bounded by a first major outer surface and a second major outer surface

Methodology Applied
Scientific EffectDielectric insulation: Dielectric

Data Source

PatentUS12176183B2RF voltage and current (V-I) sensors and measurement methods
Publication Date: 2024.12.24 TOKYO ELECTRON LTD
  • US12176183B2 patent drawing
  • US12176183B2 patent drawing
  • US12176183B2 patent drawing

AI summary

A radio frequency sensor assembly includes a sensor casing disposed around a central hole, the sensor casing including a first conductive cover and a second conductive cover. The assembly includes a cavity disposed around the central hole and includes a dielectric material, the cavity being bounded by a first major outer surface and a second major outer surface along a radial direction from a center of the central hole, where the first conductive cover is electrically coupled to the second conductive cover through a coupling region beyond the second major outer surface of the cavity, and electrically insulated from the second conductive cover by the cavity and the central hole. The assembly includes a current sensor electrically insulated from the sensor casing and including a current pickup disposed symmetrically around the central hole, the current pickup being disposed within the cavity and being insulated from the sensor casing.