Contiguous RF Shield Structures for Hybrid-Bonded Die Crosstalk
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Solution Overview
Problem
Integrated circuit (IC) dies coupled via hybrid bonding face challenges with increased signal crosstalk and reduced signal performance due to smaller interconnect pitch and z-height, particularly in stacked dies with different operating voltages and frequencies, and conventional solutions like additional ground layers or increased z-height incur cost and size penalties.
Innovation Solution
A contiguous RF shield structure is implemented using magnetic conductive materials around IC dies to suppress die-to-die signal coupling and RF interference, formed from materials like Heusler compounds and ferromagnetic materials, with a continuous structure and openings for HB contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If hybrid bonding is used to reduce interconnect pitch and z-height, then packaging density is improved, but signal crosstalk increases and signal performance deteriorates
Solution Approach 1:
The patent divides the shielding function into multiple segments by placing individual RF shield structures on each die surface. Each die's shield structure independently segments and contains RF signals, preventing them from coupling to adjacent dies. This segmentation approach maintains the compact hybrid bonding architecture while effectively isolating signals between closely-spaced dies.
Solution Approach 2:
The patent introduces RF shield structures as intermediary elements between adjacent dies. These shield structures, made of magnetic conductive materials, act as mediators that block and redirect RF electromagnetic fields, preventing direct coupling between dies while maintaining the small interconnect pitch required for high-density packaging.
2Object-affected harmful factors
If additional ground layers or increased z-height are used to reduce signal crosstalk, then signal performance is improved, but manufacturing cost and package size increase
Solution Approach 1:
Instead of adding more layers in the vertical dimension (increasing z-height) or adding ground layers in the planar dimension (increasing package size), the patent applies shielding in a different dimension by using magnetic conductive materials with specific permeability properties. This approach reduces crosstalk through material properties rather than geometric expansion, maintaining compact package dimensions.
Solution Approach 2:
The patent changes the electromagnetic parameters of the shielding structures by selecting materials with specific magnetic permeability values. By adjusting material parameters (permeability) rather than geometric parameters (size, layer count), the patent achieves effective crosstalk reduction without increasing package complexity or dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The RF shield structure effectively minimizes RF interference and signal crosstalk while maintaining a compact package size, enhancing signal performance and reducing latency without increasing cost or size.
Implementation Method 1
providing a contiguous RF shield structure on and around dies to suppress die-to-die signal coupling and RF interference
Implementation Method 2
The RF shield structure may be formed from any suitable magnetic conductive material, such as, but not limited to, a Heusler compound, ferromagnetic material, or other magnetic conductive material
Data Source
AI summary
Microelectronic assemblies, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first microelectronic component, embedded in a first dielectric layer, including a surface and one or more side surfaces at least partially encapsulated by a first magnetic conductive material; and a second microelectronic component, embedded in a second dielectric layer on the first dielectric layer, including a surface and one or more side surfaces at least partially encapsulated by a second magnetic conductive material, wherein the second microelectronic component is coupled to the surface of the first microelectronic component by a hybrid bonding region, and wherein the second magnetic conductive material is coupled to the first magnetic conductive material.