On-Chip RF Shielding via Backside Redistribution Lines
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Solution Overview
Problem
The integration of multiple components on a single semiconductor chip leads to interference from high-frequency RF circuitry, emitting electromagnetic radiation that affects other components, necessitating effective shielding without increasing production costs.
Innovation Solution
A conductive shield is integrated on-chip using backside redistribution lines and through substrate conductors to minimize electromagnetic interference, forming a three-dimensional structure around RF components, connected to ground potential and optimized for specific frequency ranges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple components are integrated on a single chip, then device functionality is improved, but electromagnetic interference between components increases
Solution Approach 1:
The chip is divided into distinct regions: an RF region containing RF circuitry and a non-RF region containing other circuitry. Through-substrate conductors are positioned at the boundaries between these regions to create electromagnetic shielding, effectively segmenting the chip into functionally isolated zones that prevent interference while maintaining integration benefits
Solution Approach 2:
Through-substrate conductors serve as intermediary elements positioned between RF and non-RF components. These conductors act as electromagnetic shields that block harmful electromagnetic fields from propagating between regions, allowing multiple components to coexist on the same chip without direct interference
2Object-affected harmful factors
If shielding structures are added to block electromagnetic radiation, then interference is reduced, but chip area and fabrication complexity increase
Solution Approach 1:
The through-substrate conductors perform multiple functions: they provide electromagnetic shielding between RF and non-RF regions while simultaneously serving as interconnect elements for signal and power distribution. This multi-functionality eliminates the need for separate dedicated shield structures, reducing overall fabrication complexity and chip area
Solution Approach 2:
The shielding function is merged with the interconnect function by using the same through-substrate conductors for both purposes. Instead of adding separate shielding layers or structures, the design combines electromagnetic shielding with existing interconnect pathways, simplifying the fabrication process and reducing chip area overhead
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively shields RF components from electromagnetic radiation, reducing interference with other chip components while avoiding additional chip area and fabrication costs, thus enhancing the performance and reliability of system-on-chip designs.
Implementation Method 1
forming a through substrate opening from a back surface of a substrate, the through substrate opening disposed between a first and a second region, the first region comprising devices for RF circuitry and the second region comprising devices for other circuitry
Data Source
AI summary
Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, a method of fabricating the system on chip includes forming a through substrate opening from a back surface of a substrate, the through substrate opening disposed between a first and a second region, the first region comprising devices for RF circuitry and the second region comprising devices for other circuitry. The method further includes forming patterns for redistribution lines on a photo resist layer, the photo resist layer disposed under the back surface, and filling the through substrate opening and the patterns for redistribution lines with a conductive material.