On-Chip RF Shielding via Redistribution Lines
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The integration of multiple components on a single semiconductor chip leads to interference issues due to electromagnetic radiation from RF circuits operating at high frequencies, which worsens with increasing technology generations, necessitating effective shielding without significant production cost increases.
Innovation Solution
The use of redistribution lines to form an electromagnetic shield, where a first set of lines minimizes parasitic elements connected to active circuitry and a second set forms a large structure acting as a barrier for electromagnetic radiation, integrated within the wafer level package to maximize shielding without additional fabrication costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple components are integrated on a single chip, then device functionality and component density are improved, but electromagnetic interference between components increases
Solution Approach 1:
The chip is divided into distinct functional regions (RF region and baseband region) separated by redistribution lines that form electromagnetic shields. This segmentation isolates the RF components from baseband components, preventing electromagnetic interference while maintaining integration benefits.
Solution Approach 2:
Redistribution lines are used as intermediary structures that serve dual purposes: electrical connection and electromagnetic shielding. These lines form a barrier between RF and baseband regions, blocking harmful electromagnetic fields while allowing signal transmission through controlled pathways.
2Object-affected harmful factors
If electromagnetic shields are added to block RF interference, then interference protection is improved, but device complexity and fabrication cost increase
Solution Approach 1:
The redistribution lines perform multiple functions simultaneously: they provide electrical connections for I/O pads, form electromagnetic shields between regions, and serve as part of the packaging structure. This multi-functionality eliminates the need for separate shielding layers, reducing fabrication complexity and cost.
Solution Approach 2:
The electromagnetic shielding function is merged with the existing redistribution line structure rather than being implemented as a separate component. The same metal layers and routing structures used for electrical interconnection are configured to provide electromagnetic barrier functionality, simplifying the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively blocks electromagnetic radiation emitted by RF components, minimizing interference with other components on the chip while maintaining low production costs by integrating the shield within the wafer level packaging process.
Implementation Method 1
second redistribution lines disposed above the RF component, the second redistribution lines coupled to ground potential nodes, the second redistribution lines comprising a first set of parallel metal lines coupled together by a second set of parallel metal lines
Data Source
AI summary
A system on chip comprising a RF shield is disclosed. In one embodiment, the system on chip includes a RF component disposed on a chip, first redistribution lines disposed above the system on chip, the first redistribution lines coupled to I/O connection nodes. The system on chip further includes second redistribution lines disposed above the RF component, the second redistribution lines coupled to ground potential nodes. The second redistribution lines include a first set of parallel metal lines coupled together by a second set of parallel metal lines.