RF Module Resistive Shield Layout for Better Terminal Isolation
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Solution Overview
Problem
Isolation between RF terminals in radio frequency modules degrades, leading to performance issues.
Innovation Solution
A radio frequency module design incorporating a mounting board, electronic components, a resin layer, and a conductive layer with varying resistivity portions to enhance isolation between RF terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional conductive layer is used to cover the resin layer, then electromagnetic shielding is provided, but isolation between RF terminals degrades due to signal leakage through the conductive layer
Solution Approach 1:
The conductive layer is designed with spatially varying resistivity: a first conductive portion with higher resistivity is positioned between RF terminals to block signal leakage, while a second conductive portion with lower resistivity is positioned elsewhere to maintain electromagnetic shielding. This local differentiation of conductive properties resolves the contradiction between shielding effectiveness and isolation performance.
Solution Approach 2:
The resistivity parameter of the conductive layer is changed across different regions. By controlling the resistivity distribution (higher in the first conductive portion, lower in the second), the layer can simultaneously achieve signal leakage prevention between RF terminals and adequate electromagnetic shielding in other areas.
2Reliability
If the conductive layer has high conductivity for shielding, then electromagnetic interference is reduced, but isolation between RF terminals degrades due to increased signal leakage
Solution Approach 1:
Different regions of the conductive layer are assigned different conductivity levels based on their functional requirements. The first conductive portion has higher resistivity (lower conductivity) to prevent signal leakage between RF terminals, while the second conductive portion has lower resistivity (higher conductivity) to provide effective electromagnetic shielding against external interference.
Solution Approach 2:
The conductive layer is segmented into functionally distinct portions: a first conductive portion for isolation (higher resistivity) and a second conductive portion for shielding (lower resistivity). This segmentation allows each region to optimize its performance for its specific purpose without compromising the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves isolation between RF terminals, enhancing the performance and functionality of the radio frequency module.
Implementation Method 1
The conductive layer includes a first conductive portion and a second conductive portion. The first conductive portion is positioned in between the first RF terminal and the second RF terminal... The resistivity of the first conductive portion is higher than the resistivity of the second conductive portion.
Data Source
AI summary
In the radio frequency module, a first electronic component and a second electronic component are mounted on a principal surface of a mounting board. A resin layer covers an outer perimeter surface of the first electronic component and an outer perimeter surface of the second electronic component. A conductive layer covers the resin layer and overlaps the first electronic component and the second electronic component in a plan view. The conductive layer includes a first conductive portion and a second conductive portion. The first conductive portion is positioned in between the first RF terminal of the first electronic component and the second RF terminal of the second electronic component in the plan view. The second conductive portion is adjacent to the first conductive portion in the plan view. The resistivity of the first conductive portion is higher than the resistivity of the second conductive portion.