RF Module Shield Plate Structure for Inductor Coupling Suppression

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Solution Overview

Problem

In mobile communication equipment, electromagnetic coupling between inductors in transmitting, receiving, and transmitting/receiving paths leads to signal quality degradation due to harmonic components and spurious waves, reducing isolation and receiving sensitivity.

Innovation Solution

A radio-frequency module with a module substrate, inductors, a resin member, a metal shield layer, and a metal shield plate configured to isolate inductors, suppressing electromagnetic field coupling and enhancing signal quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If inductors are disposed close to each other in transmitting, receiving, and transmitting/receiving paths, then device complexity is reduced, but electromagnetic coupling occurs causing signal quality degradation

Engineering Contradiction:
Improvecircuit element arrangementVSAvoidsignal quality
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

A ground electrode is introduced as an intermediary element between inductors in different signal paths (transmitting, receiving, transmitting/receiving). This ground electrode acts as a shield that prevents electromagnetic coupling between adjacent inductors, thereby maintaining signal quality while allowing compact arrangement of circuit elements on the module substrate.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Area of stationary object

If inductors are arranged compactly on the module substrate, then area is reduced, but electromagnetic field coupling increases causing isolation degradation

Engineering Contradiction:
Improvemodule substrate areaVSAvoidisolation between paths
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

Ground electrodes are positioned between inductors in different signal paths to serve as electromagnetic shields. These ground electrodes maintain electrical isolation between transmitting, receiving, and transmitting/receiving paths while enabling compact placement of inductors on the module substrate, thus preserving isolation performance in a reduced area.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If inductors are placed adjacent to each other, then manufacturing precision requirements are reduced, but harmonics and spurious waves affect receiving sensitivity

Engineering Contradiction:
Improveinductor placement precisionVSAvoidreceiving sensitivity
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

Ground electrodes are introduced as intermediary shielding elements between adjacent inductors. These ground electrodes block the propagation of harmonics and spurious waves from transmitting path inductors to receiving path inductors, thereby protecting receiving sensitivity while allowing relaxed manufacturing precision for inductor placement.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The configuration improves signal isolation and reduces signal degradation by preventing harmonics and spurious waves from affecting receiving paths, maintaining signal quality.

Implementation Method 1

a metal shield layer covering a surface of the resin member and set to a ground potential, and a first metal shield plate disposed on the major surface between the first inductor and the second inductor

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS12580532B2Radio-frequency module and communication device
Publication Date: 2026.03.17 MURATA MFG CO LTD
  • US12580532B2 patent drawing
  • US12580532B2 patent drawing
  • US12580532B2 patent drawing

AI summary

A radio-frequency module includes a first inductor and a second inductor disposed on or above a major surface of a module substrate, a resin member, a metal shield layer covering a surface of the resin member, and a metal shield plate disposed on the major surface between the first inductor and the second inductor. The metal shield plate is in contact with a ground electrode of the major surface and the metal shield layer. The first inductor is disposed in any one of a transmitting path, a receiving path, and a transmitting and receiving path. The second inductor is disposed in any one of the transmitting path, the receiving path, and the transmitting and receiving path, other than the path in which the first inductor is disposed.