Semiconductor Deposition Chamber Shielding for RF Shower Head Interference
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in preventing electromagnetic interference between shower heads during radio-frequency power application, which can affect deposition uniformity and film density in thin-film formation.
Innovation Solution
The use of shielding members, including shower-head shielding members and strap shielding members, is implemented to enclose shower heads and power straps within the chamber, preventing electromagnetic interference and ensuring efficient radio-frequency power delivery without parasitic capacitance or noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple shower heads are used in parallel for thin-film deposition, then productivity is improved, but electromagnetic interference between shower heads causes deposition uniformity to deteriorate
Solution Approach 1:
A ground shield is introduced as an intermediary component between adjacent shower heads. The ground shield acts as a mediator that intercepts and grounds electromagnetic signals, preventing direct interference between shower heads while allowing both to operate in parallel for high productivity
2Productivity
If radio-frequency power is applied to multiple shower heads simultaneously, then deposition rate is improved, but electromagnetic interference causes film density to deteriorate
Solution Approach 1:
The ground shield serves as a mediator that allows simultaneous RF power application to multiple shower heads while preventing electromagnetic interference. By providing a grounded barrier, it enables high deposition rates without compromising film density uniformity
3Manufacturing precision
If shower heads are positioned closer together to increase substrate coverage, then manufacturing precision is improved, but electromagnetic interference increases causing deposition uniformity to deteriorate
Solution Approach 1:
The ground shield is positioned between closely-spaced shower heads as an intermediary barrier. It allows the shower heads to be positioned close together for uniform substrate coverage while the shield intercepts electromagnetic fields, preventing interference despite the reduced spacing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses electromagnetic interference, improving deposition uniformity and increasing film density by ensuring consistent and efficient radio-frequency power application to the substrates, thereby enhancing the semiconductor device manufacturing process.
Implementation Method 1
providing radio-frequency powers to the shower heads, without an electromagnetic interference between the shower heads using shielding members, which are provided in the chamber and enclosing the shower heads
Data Source
AI summary
An apparatus for manufacturing a semiconductor device includes a chamber including a lower housing and an upper housing, heater chucks in the lower housing, shower heads on the heater chucks, the shower heads being between the lower housing and the upper housing, power supplies connected to the shower heads to provide radio-frequency powers to the shower heads, power straps in the upper housing to connect the shower heads to the power supplies, and shielding members in the upper housing, the shielding members enclosing the power straps and the shower heads, respectively, the shielding members to prevent electromagnetic interference of the radio-frequency powers between the power straps and between the shower heads.