RF Module Splitter Combiner Stray Capacitance Reduction
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Solution Overview
Problem
In radio-frequency module components, close proximity between the splitter/combiner and shield case can lead to stray capacitance, deteriorating the filter characteristic and increasing the size of the module due to the need for longer wiring patterns and additional space.
Innovation Solution
A radio-frequency module component design featuring a multilayer splitter/combiner with specific electrode configurations and a shield case arrangement that minimizes stray capacitance, allowing the splitter/combiner to be positioned close to the shield case without compromising filter characteristics, and includes a resin fill to enhance electrostatic capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the splitter/combiner is separated from the shield case by a predetermined distance, then stray capacitance is reduced and filter characteristic is maintained, but the size of the radio-frequency module component is increased and wiring pattern length is extended
Solution Approach 1:
The invention divides the electrode structure into multiple segments: a common input/output electrode, individual input/output electrodes, and an outer ground electrode. By segmenting the electrode functions and positioning them at different locations on the splitter/combiner, the patent reduces stray capacitance effects while maintaining compact dimensions. The segmentation allows each electrode to be optimally positioned relative to the shield case without requiring excessive separation distance.
Solution Approach 2:
The invention utilizes three-dimensional spatial arrangement by positioning electrodes at specific locations on the splitter/combiner body, including at edges of side surfaces. This dimensional approach allows the common input/output electrode and individual input/output electrodes to be positioned in different spatial zones, reducing parasitic capacitance effects without increasing the overall module footprint.
2Reliability
If the splitter/combiner is separated from the shield case by a predetermined distance, then stray capacitance is reduced and filter characteristic is maintained, but the wiring pattern length is extended causing increased transmission loss
Solution Approach 1:
The segmented electrode structure enables the common input/output electrode and individual input/output electrodes to be positioned at optimal locations on the splitter/combiner. This segmentation allows wiring patterns to be routed more efficiently, reducing their length and associated transmission losses while still maintaining adequate separation from the shield case to control stray capacitance.
Solution Approach 2:
The invention applies local quality optimization by positioning specific electrodes at specific locations on the splitter/combiner. The common input/output electrode is positioned at a first location, individual input/output electrodes at second locations, and the outer ground electrode at a third location. This localized electrode placement optimizes both the electrical performance (reducing stray capacitance) and the wiring efficiency (reducing transmission loss).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design maintains the filter characteristic of the splitter/combiner even when close to the shield case, reduces transmission loss, and minimizes the module's size by eliminating the need for additional space between components.
Implementation Method 1
utilizing a resin fill and metal shield case to enhance electrostatic capacitance
Implementation Method 2
utilizing a resin fill and metal shield case to enhance electrostatic capacitance
Data Source
AI summary
A radio-frequency module component includes a splitter/combiner and a shield case. The splitter/combiner includes a multilayer body, a common input/output electrode, a low-band input/output electrode, a high-band input/output electrode, and outer ground electrodes. The multilayer body includes insulating layers and electrode patterns stacked on each other, and side surfaces opposed to each other. The common input/output electrode is disposed on one of the side surfaces and a bottom surface of the multilayer body. The low-band input/output electrode and the high-band input/output electrode are disposed on another of the side surfaces and the bottom surface of the multilayer body. An additional side surface of the multilayer body opposes a side surface of the shield case in the closest proximity to each other.