RF Sputter Deposition Source Defined Return Path
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
RF sputtering processes often experience arcing and parasitic plasma due to undefined RF return paths in vacuum deposition systems, leading to unstable deposition conditions and target damage.
Innovation Solution
A defined RF return path is established using a conductor rod extending through the vacuum chamber wall, connected to a shielding box and RF power supply, providing a controlled path for RF currents and reducing arcing and parasitic plasmas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional RF sputtering system is used without a defined RF return path, then the system structure is simpler, but arcing and parasitic plasma occur leading to unstable deposition conditions and target damage
Solution Approach 1:
A conductor rod is introduced as an intermediary component to establish a defined RF return path between the RF power supply and the vacuum chamber wall. This mediator provides a controlled pathway for RF currents, preventing uncontrolled arcing and parasitic plasma formation while maintaining system reliability.
Solution Approach 2:
The RF return path is segmented into distinct components: the conductor rod extending through the vacuum chamber wall, the RF power supply connection, and the target connection. This segmentation allows each component to be optimized independently and simplifies the overall system design while ensuring stable RF current flow.
2Object-affected harmful factors
If shielding box is positioned close to the wall portion, then the structure is more compact, but RF current paths become undefined causing arcing
Solution Approach 1:
The distance parameter between the shielding box and the vacuum chamber wall is optimized to maintain a defined RF current path. By controlling this spatial parameter, the system prevents arcing and parasitic plasma formation while minimizing the volume occupied by the shielding box, achieving a balance between harmful factor reduction and compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the stability of deposition conditions, improves layer quality, and reduces or eliminates arcing and target damage, ensuring consistent and efficient sputter deposition.
Implementation Method 1
an RF power supply for providing RF power to the target
Implementation Method 2
a conductor rod extending through the wall portion from inside of the vacuum chamber to outside of the vacuum chamber, wherein the conductor rod is connected to one or more components inside of the vacuum chamber and wherein the conductor rod is connected to the RF power supply outside of the vacuum chamber to generate a defined RF return path
Implementation Method 3
the one or more components comprises a shielding box, the shielding box is connected to the conductor rod
Implementation Method 4
Sputtering generates a stream of coating material by sputtering a target through the use of a plasma. During this a process in which material is released from the surface of the target by collision with high-energy particles from the plasma
Data Source
Figure 1~2
Figure 3A
Figure 3B
AI summary
A sputter deposition source for sputter deposition in a vacuum chamber is described. The source includes a wall portion of the vacuum chamber; a target providing a material to be deposited during the sputter deposition; an RF power supply for providing RF power to the target; a power connector for connecting the target with the RF power supply; and a conductor rod extending through the wall portion from inside of the vacuum chamber to outside of the vacuum chamber, wherein the conductor rod is connected to one or more components inside of the vacuum chamber and wherein the conductor rod is connected to the RF power supply outside of the vacuum chamber to generate a defined RF return path through the conductor rod.