Embedded RF Stack Antenna Assembly for Direct Waveguide Coupling
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Solution Overview
Problem
Conventional antenna modules suffer from signal quality loss due to distance between circuit boards and waveguide antennas, increased package size from launcher structures, poor mechanical stability, and inefficiencies in integrating multiple RF chips, leading to challenges in miniaturization and reliability under harsh conditions.
Innovation Solution
An antenna assembly comprising a stack with an embedded RF component and an electromagnetic wave coupling structure connected to a channel in an antenna structure, allowing direct coupling of RF signals through a compact, aligned design that includes metallized channel walls and etched metal structures for improved signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If conventional waveguide antennas are assembled onto circuit boards with distance separation, then mechanical stability is improved, but signal quality deteriorates due to signal losses
Solution Approach 1:
The patent merges the circuit board and waveguide antenna into a single integrated structure where the circuit board itself forms the waveguide channels. This eliminates the distance separation between components while maintaining mechanical stability through the unified structure, thereby resolving the contradiction between mechanical stability and signal quality.
Solution Approach 2:
The circuit board is designed to serve multiple functions simultaneously: it acts as both the structural support (mechanical stability) and the waveguide transmission path (signal quality). The metallized layers and channel structures within the circuit board enable it to perform both mechanical and electromagnetic functions, eliminating the need for separate components.
2Reliability
If launcher structures are added to feed RF signals into waveguides, then signal transmission is improved, but package size increases
Solution Approach 1:
The launcher structure is merged with the circuit board itself rather than being a separate component. The conductive layers and channel structures are integrated directly into the circuit board's architecture, eliminating the need for additional space-consuming launcher assemblies while maintaining effective RF signal feeding into the waveguide channels.
Solution Approach 2:
The launcher function is achieved through planar conductive patterns and metallized structures on the circuit board surface and within its layers, rather than requiring three-dimensional protruding structures. This two-dimensional integration approach maintains signal transmission effectiveness while minimizing volume increase.
3Adaptability or versatility
If multiple RF chips are integrated on a component carrier, then functionality is improved, but heat generation and EMI protection challenges increase
Solution Approach 1:
The component carrier is divided into separate functional zones with dedicated waveguide channels for each RF chip. This segmentation allows independent thermal and electromagnetic management for each chip, reducing mutual interference and heat accumulation while maintaining multiple RF functionalities simultaneously.
Solution Approach 2:
The waveguide channels and metallized structures serve as intermediaries that guide RF signals away from the RF chips, reducing electromagnetic interference. The structured channels also facilitate heat dissipation pathways, acting as thermal management intermediaries between the chips and the external environment.
4Reliability
If through-holes with metallized sidewalls are used to elongate waveguide channels, then signal guidance is improved, but manufacturing complexity increases
Solution Approach 1:
The through-holes and their metallized sidewalls are merged with the existing circuit board manufacturing process. The waveguide channels are formed using standard PCB drilling and plating techniques, integrating the waveguide functionality into the常规 circuit board fabrication steps without requiring separate complex manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces package size, enhances signal quality, and increases mechanical reliability by aligning the stack and antenna structure, enabling efficient integration of multiple RF channels and launchers, while minimizing production misalignments and material losses.
Implementation Method 1
an electromagnetic wave coupling structure (115) arranged at a surface of the stack (110) and facing an opening (125) at a surface of the antenna structure (120)... configured to act at least as part of an electromagnetic wave coupling structure
Data Source
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AI summary
There is described an antenna assembly (100) comprising: i) a stack (110) comprising: ia) at least one electrically conductive layer structure (104) and at least one electrically insulating layer structure (102), wherein at least a portion of said electrically conductive layer structure (104, 115) is provided at the external side of the stack (110) and is configured to act at least as part of an electromagnetic wave coupling structure (115); and ib) a component (130), at least partially embedded in the stack (110), and coupled to said electromagnetic wave coupling structure (115); and ii) an antenna structure (120), comprising an opening (125) to a channel (121) passing through the antenna structure (120). The stack (110) and the antenna structure (120) are connected, so that the electromagnetic wave coupling structure (115) and the opening (125) to the channel (121) face each other.