Low Permittivity RF Substrate Monolithic Lattice Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current low permittivity RF substrates face challenges such as inability to support electronic circuit imaging, electroplating, and vias due to their porous nature, limiting their use in multi-layered designs and requiring additional lamination processes.
Innovation Solution
A substrate with a monolithic lattice structure that includes interstitial spaces, allowing for solid surfaces for circuit imaging and in-situ via creation, formed through 3D printing or additive manufacturing, enabling mechanical robustness and lower permittivity without the need for additional lamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If foam materials are used to create low Dk substrates, then radiation efficiency and bandwidth are improved, but the ability to support electronic circuit imaging, electroplating, and vias is lost
Solution Approach 1:
The substrate employs a hybrid structure where the core region has a foamed polymer material with low Dk for optimal RF performance, while the surface regions have solidified layers that provide mechanical support and enable circuit imaging, electroplating, and via formation. This local differentiation of material properties resolves the contradiction between low Dk requirement and manufacturability requirement.
Solution Approach 2:
The substrate is constructed as a composite material system combining foamed polymer core with solidified surface layers (epoxy resin or other suitable materials). This composite structure integrates the low permittivity advantage of foam materials with the manufacturing capabilities enabled by solid surfaces, allowing both RF optimization and standard fabrication processes.
2Loss of energy
If foam materials are used to create low Dk substrates, then radiation efficiency is improved, but the ability to drill and plate vias is prohibited
Solution Approach 1:
The substrate employs a hybrid structure where the core region has a foamed polymer material with low Dk for optimal RF performance, while the surface regions have solidified layers that provide mechanical support and enable circuit imaging, electroplating, and via formation. This local differentiation of material properties resolves the contradiction between low Dk requirement and manufacturability requirement.
Solution Approach 2:
The via holes are formed through the solidified surface layers before the foamed core is fully cured or after the solidified layer is applied. This preliminary action of creating via pathways in the solid material before final assembly allows subsequent electroplating to proceed effectively, overcoming the limitation of working with fully cured foam materials.
3Loss of energy
If foam materials are used to create low Dk substrates, then bandwidth is improved, but the need for additional lamination processes increases
Solution Approach 1:
The substrate manufacturing process merges the formation of the low Dk foamed core with the application of solidified surface layers in an integrated process. The solidified layers are applied directly to the foamed core in the same manufacturing cycle, eliminating the need for separate lamination steps that would otherwise be required to attach circuit materials to foam surfaces.
Solution Approach 2:
The solidified surface layers serve multiple functions simultaneously: they provide mechanical support for handling, enable circuit imaging through standard photo lithography processes, allow electroplating for via and trace formation, and serve as the bonding interface for stacking multiple layers. This multi-functionality eliminates the need for separate specialized processes for each function.
4Loss of energy
If foam materials are used to create low Dk substrates, then radiation efficiency is improved, but mechanical robustness and support for printed antennas are reduced
Solution Approach 1:
The substrate employs a hybrid structure where the core region has a foamed polymer material with low Dk for optimal RF performance, while the surface regions have solidified layers that provide mechanical support and enable circuit imaging, electroplating, and via formation. This local differentiation of material properties resolves the contradiction between low Dk requirement and manufacturability requirement.
Solution Approach 2:
The substrate is constructed as a composite material system combining foamed polymer core with solidified surface layers (epoxy resin or other suitable materials). This composite structure integrates the low permittivity advantage of foam materials with the manufacturing capabilities enabled by solid surfaces, allowing both RF optimization and standard fabrication processes.
Data Source
AI summary
A substrate includes a monolithic structure formed from a dielectric material having a first side, a second side, and an intermediate region between the first side and the second side, and the intermediate region has a lattice structure of the dielectric material having a plurality of interstitial spaces between the dielectric material of the lattice structure. The lattice structure extends between and monolithically connects with the first side and the second side, wherein at least one of the first side and the second side has a substantially solid surface suitably configured to support one or more of electronic circuit imaging, electroplating, metal deposition, or, vias between the first side and the second side.