Integrally Formed RF Switch Network Housing
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Solution Overview
Problem
Conventional switch network designs for radio frequency (RF) signals require large and heavy housings due to long waveguides and numerous coupling components, which are impractical for spatially and weight-constrained environments like satellite payloads, where ease of access and mechanical tolerances are challenging.
Innovation Solution
The design integrates waveguides with switch blocks, allowing for a compact switch network with fewer components, using additive layer manufacturing to form the housing, which reduces size and weight while optimizing spatial configuration and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If waveguides are constructed separately and assembled with switch blocks using conventional manufacturing processes, then ease of assembly and access is improved, but the overall housing becomes large and heavy
Solution Approach 1:
The patent combines previously separate components (waveguides and switch blocks) into a single integrally formed housing structure. This merging eliminates the need for separate assembly of waveguides with switches, reducing the number of coupling components and overall housing size, thereby reducing weight while maintaining assembly capability
Solution Approach 2:
The patent employs additive layer manufacturing to create complex three-dimensional waveguide paths within the integral housing structure. This manufacturing approach enables optimization of waveguide routing in multiple dimensions, allowing compact spatial configuration that reduces overall housing volume and weight while maintaining proper signal paths
2Adaptability or versatility
If long waveguides are used to connect switches together to accommodate complex signal paths, then signal routing flexibility is improved, but housing size and weight increase
Solution Approach 1:
The patent uses additive layer manufacturing to create complex three-dimensional waveguide paths within the integral housing structure. This enables optimization of waveguide routing in multiple dimensions, allowing compact spatial configuration that reduces overall housing volume while maintaining proper signal paths and routing flexibility
Solution Approach 2:
The patent nests waveguides within the integral housing structure, allowing waveguides to be embedded within the housing material itself rather than extending externally. This nesting approach reduces the external dimensions of the housing while maintaining the necessary signal path lengths and routing flexibility
3Ease of operation
If numerous coupling and mounting components are used to assemble switch network components, then ease of assembly and access is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple separate components (waveguides, switch blocks, coupling components, and mounting structures) into a single integrally formed housing. This consolidation dramatically reduces the number of discrete components and assembly steps, simplifying the overall device while maintaining assembly capability through the integral structure
Solution Approach 2:
While the housing is integrally formed, the patent maintains functional segmentation by providing separate receptacles for different switch blocks and distinct waveguide paths for different signal routes. This functional segmentation allows the complex device to be designed as a unified structure that still provides organized access and modular functionality
Data Source
AI summary
A housing for a switch network is provided, comprising a plurality of switch blocks, each of the switch blocks being adapted to receive a radio frequency switch, and one or more interlink waveguides. At least one of the waveguides is arranged to connect a respective two or more of the switch blocks to each other and arranged externally with respect to the two switch blocks. At least one of the one or more waveguides is integrally formed with at least one of the switch blocks. A method of manufacturing the housing is also provided.