Integrated RF Switch Inductor Layout for Smaller Multiband Modules
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Solution Overview
Problem
High-frequency modules face challenges in reducing size while maintaining multiband and multimode functions, as existing technologies find it difficult to integrate components effectively to achieve both size reduction and functional performance.
Innovation Solution
Integration of an inductor with the switching circuit within the high-frequency module, either built into the semiconductor substrate or integrated with resin, allows for reduced space usage and enhanced signal processing capabilities, enabling smaller module sizes and improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the inductor is mounted separately from the switching circuit in the high-frequency module, then the inductor can be easily installed and maintained, but the module size increases due to additional mounting space requirements
Solution Approach 1:
The patent integrates the inductor directly into the switching circuit by forming it on the same semiconductor substrate. The inductor is created using conductive patterns deposited and etched on the substrate, merging two previously separate components (inductor and switching circuit) into a single integrated structure, thereby eliminating additional mounting space while maintaining functionality
Solution Approach 2:
The inductor is formed using multi-layer conductive patterns on the semiconductor substrate, utilizing the vertical dimension (multiple layers) to create the inductive structure. This approach transforms the traditional planar mounting into a three-dimensional integrated structure, maximizing space utilization and reducing the overall module footprint
2Adaptability or versatility
If multiple components are mounted in the high-frequency module, then the multiband and multimode functions are achieved, but the module size increases due to the additional space required for each component
Solution Approach 1:
The switching circuit is designed to selectively connect the common terminal to multiple selection terminals (first, second, and third selection terminals), enabling the same circuit structure to support multiple frequency bands and modes. This multi-functional switching capability eliminates the need for separate dedicated circuits for each function, reducing overall module size while maintaining versatility
Solution Approach 2:
The patent combines multiple functional components (switching circuit, inductor, and filtering elements) into a single integrated structure on the semiconductor substrate. By merging these components that would traditionally require separate mounting, the module achieves multiband and multimode functionality without proportionally increasing in size
Data Source
AI summary
A switch component includes a common terminal, at least two selection terminals, a switching circuit that selectively connects the common terminal to each of the at least two selection terminals, and an inductor. One end of the inductor is connected to one of the at least two selection terminals. The switching circuit is integrated with the inductor.