RF Switch Circuit Layout for Multi-Band Signal Quality and Heat Control

Solution Overview

Problem

Existing RF circuits face challenges in maintaining compact size while supporting multiple bands and modes of operation, leading to increased heat dissipation and deterioration of signal quality during simultaneous signal transfer.

Innovation Solution

The RF circuit incorporates a first and second transfer circuit with power amplifiers and switch circuits, allowing selective connection of antennas for simultaneous transmission and reception of multiple RF signals, reducing heat dissipation and maintaining signal quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple antennas are connected to an RF circuit including multiple power amplifiers to support increasing band combinations for simultaneous transfer, then the adaptability for multi-band and multi-mode operation is improved, but the device size increases

Engineering Contradiction:

Improveband combination supportVSAvoidRF circuit size

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The RF circuit is divided into multiple transfer circuits (first transfer circuit with first and second power amplifiers, second transfer circuit with third power amplifier). Each transfer circuit handles specific band combinations, allowing the system to support multiple bands and modes through modular segmentation rather than requiring a single large circuit capable of all operations simultaneously.

Inventive Principle:

Principle #1Segmentation

2Reliability

If multiple antennas are connected to an RF circuit including multiple power amplifiers to support simultaneous transfer, then the heat dissipation efficiency needs to be increased to reduce signal quality deterioration, but increasing heat dissipation efficiency may increase the size of the RF circuit

Engineering Contradiction:

Improvesignal qualityVSAvoidRF circuit size

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The RF circuit is divided into multiple transfer circuits (first transfer circuit with first and second power amplifiers, second transfer circuit with third power amplifier). Each transfer circuit handles specific band combinations, allowing the system to support multiple bands and modes through modular segmentation rather than requiring a single large circuit capable of all operations simultaneously.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The switch circuits enable dynamic connection configuration, allowing the system to adaptively connect different antennas to different power amplifiers based on the required band combination. This dynamic reconfiguration optimizes heat dissipation by distributing power amplifier operations across multiple circuits rather than concentrating all operations in a single circuit.

Inventive Principle:

Principle #15Dynamics

3Area of stationary object

If a compact RF circuit is designed to reduce size, then the device complexity is reduced, but the ability to maintain signal quality during simultaneous transfer deteriorates due to increased heat dissipation

Engineering Contradiction:

ImproveRF circuit sizeVSAvoidsignal quality

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

The RF circuit is divided into multiple transfer circuits (first transfer circuit with first and second power amplifiers, second transfer circuit with third power amplifier). Each transfer circuit handles specific band combinations, allowing the system to support multiple bands and modes through modular segmentation rather than requiring a single large circuit capable of all operations simultaneously.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The switch circuits enable dynamic connection configuration, allowing the system to adaptively connect different antennas to different power amplifiers based on the required band combination. This dynamic reconfiguration optimizes heat dissipation by distributing power amplifier operations across multiple circuits rather than concentrating all operations in a single circuit.

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS20260051920A1Radio frequency circuit and communication device

Publication Date: 2026.02.19 MURATA MFG CO LTD

AI summary

A radio frequency circuit includes a first transfer circuit including a first power amplifier, a second power amplifier, and a first switch circuit; and a second transfer circuit including a third power amplifier and a second switch circuit. The first switch circuit includes first and second input/output terminals, first and second antenna terminals, first and second inter-module terminals. The second switch circuit includes a third input/output terminal, third and fourth antenna terminals, third and fourth inter-module terminals. The first to third power amplifiers are respectively connected to the first to third input/output terminals. The first inter-module terminal is connected to the third inter-module terminal. The second inter-module terminal is connected to the fourth inter-module terminal. The first to third input/output terminals are each selectively connectable to the first antenna terminal, the second antenna terminal, the third antenna terminal, and the fourth antenna terminal.