RF Module Switch Layout for Multi-Band Transmission Isolation
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Solution Overview
Problem
Existing radio frequency modules face challenges in maintaining isolation when simultaneously transmitting multiple transmission signals in different frequency bands, leading to potential interference.
Innovation Solution
A radio frequency module design featuring a first and second power amplifier, along with first, second, and third switches, disposed on a mounting substrate, allowing simultaneous connection to antenna terminals, with switches positioned on different main surfaces to manage different frequency bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple transmission signals in different frequency bands are simultaneously transmitted using conventional FET design, then communication versatility is improved, but isolation is lowered causing signal interference
Solution Approach 1:
The patent applies three-dimensional stacking of switches on different layers of the mounting substrate. The first switch is disposed on a first main surface while the second and third switches are disposed on a second main surface opposite to the first main surface. This vertical arrangement in the thickness direction creates spatial separation between signal paths, improving isolation between different frequency bands while enabling simultaneous transmission of multiple signals.
2Device complexity
If multiple switches are disposed on the same main surface of the mounting substrate, then device complexity is reduced, but isolation between different frequency bands deteriorates
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional layered arrangement. The first switch is disposed on a first main surface of the mounting substrate, while the second and third switches are disposed on a second main surface opposite to the first main surface. This vertical separation in the thickness direction increases the physical distance between signal paths, thereby improving isolation between different frequency bands without significantly increasing device complexity.
3Length of moving object
If first switch is disposed between second switch and third switch in plan view, then signal path length is reduced, but isolation between simultaneous transmissions is lowered
Solution Approach 1:
The patent resolves the contradiction by moving the arrangement from a linear one-dimensional arrangement to a three-dimensional layered structure. The first switch is disposed on a first main surface while the second and third switches are disposed on a second main surface. This vertical separation creates independent signal paths in the thickness direction, maintaining short path lengths while achieving high isolation between simultaneous transmissions through spatial separation.
Data Source
AI summary
Assuming transmission signals in different frequency bands are simultaneously transmitted, the isolation lowering is suppressed. A radio frequency module includes a first power amplifier, a second power amplifier, a first switch, a second switch, a third switch, and a mounting substrate. The first switch, the second switch, and the third switch are configured to be capable of simultaneously connecting the first power amplifier and the second power amplifier to an antenna terminal. The first switch is disposed between the second switch and the third switch in plan view of the mounting substrate from a thickness direction. The second switch and the third switch are disposed on the same main surface out of the first main surface and the second main surface of the mounting substrate.