High-Frequency Switch Module Layout for RF and Power Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-frequency switch modules face issues with power noise leakage from the power supply wiring to other internal wirings, leading to property degradation such as harmonic distortion, due to inadequate impedance and electrical properties in existing configurations.
Innovation Solution
The implementation of a high-frequency switch module with a multilayer board design that includes power supply wiring, signal wiring, and internal ground electrodes spaced apart to increase isolation, where the internal ground electrodes are separated from both the power supply and signal wirings, effectively preventing noise leakage and allowing for desired impedance settings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an internal ground electrode is provided on an entire predetermined interface within a multilayer board to prevent power noise leakage, then power noise leakage is reduced, but a desired impedance or electrical property cannot be obtained for other internal wirings
Solution Approach 1:
The internal ground electrode is divided into multiple segments (first internal ground electrode and second internal ground electrode) that are spaced apart from each other. This segmentation allows the ground electrode to prevent power noise leakage while maintaining desired impedance characteristics for signal wirings, as the segmented structure creates isolated ground regions that do not continuously interfere with adjacent signal paths.
Solution Approach 2:
The ground electrode structure is designed with different local configurations - the first internal ground electrode is positioned to shield power supply wiring, while the second internal ground electrode is positioned to shield signal wirings. This local differentiation allows each ground electrode segment to optimize its function for the specific wiring it protects, maintaining both noise prevention and impedance control.
2Object-affected harmful factors
If internal ground electrodes are used to shield power supply wiring, then power noise leakage is prevented, but noise may leak from the power supply wiring through the internal ground electrode to other internal wiring
Solution Approach 1:
By dividing the internal ground electrode into spaced-apart segments, the patent prevents continuous noise transmission paths. The gaps between the first and second internal ground electrode segments break the potential noise leakage path, so even if noise is introduced to the power supply wiring, it cannot continuously leak through a continuous ground electrode to other wirings.
Solution Approach 2:
The spaced-apart internal ground electrode segments act as intermediary shielding elements that provide noise protection without creating continuous conduction paths. The insulating material layers between the segments serve as mediators that block noise transmission while maintaining the shielding function.
Data Source
AI summary
In a high-frequency switch module, a switch IC is mounted on a multilayer board to define a high-frequency switch module. The multilayer board includes two internal wirings and two internal ground electrodes. The internal ground electrodes are spaced apart from each other at an interval when viewed from a lamination direction of the multilayer board. The first internal wiring is located on the upper surface side of the first internal ground electrode, and is entirely separated from an RF wiring, and the first internal wiring includes a power supply wiring for supplying power to the switch IC. The second internal wiring is located on the upper surface side of the second internal ground electrode, and is entirely separated from the power supply wiring, and the second internal wiring includes a signal wiring through which an RF signal propagates.