RF Switch Redistribution Layer Inductance for Lower Insertion Loss
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Solution Overview
Problem
Existing radio-frequency (RF) switches face challenges due to parasitic capacitance, which leads to increased insertion loss and higher implementation costs, particularly in flip chip devices where external inductors are used to compensate for this capacitance.
Innovation Solution
Implementing a redistribution layer (RDL) inductance within the semiconductor chip to provide a selected inductance that compensates for parasitic capacitance, reducing insertion loss and eliminating the need for external inductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If external inductors are used to compensate for parasitic capacitance, then the insertion loss is reduced, but the device complexity and cost increase
Solution Approach 1:
The patent merges the inductor function with the existing redistribution layer structure. The signal path is routed through the redistribution layer to create an inductance effect, combining the electrical connection function with the inductance compensation function in a single integrated structure, thereby eliminating external inductors and reducing device complexity
Solution Approach 2:
The redistribution layer is designed to serve multiple functions: it provides electrical connections between different layers and simultaneously provides the required inductance for parasitic capacitance compensation. This multi-functionality eliminates the need for separate external inductor components
2Loss of energy
If external inductors are used to compensate for parasitic capacitance, then the insertion loss is reduced, but the manufacturing cost increases
Solution Approach 1:
The inductor function is merged into the redistribution layer that is already part of the standard semiconductor manufacturing process. By utilizing the existing layered structure and routing signals through specific paths in the redistribution layer, the patent eliminates the need for separate external inductor components, thereby reducing manufacturing cost
Solution Approach 2:
The redistribution layer structure itself provides the inductance function without requiring external components. The signal path routing through the redistribution layer creates the necessary inductance effect, making the system self-sufficient and eliminating additional manufacturing steps for external inductor integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The RDL inductance reduces insertion loss by approximately 0.2 dB and achieves a Q value greater than 20, providing effective compensation for parasitic capacitance without increasing costs.
Implementation Method 1
The signal path has a first end electrically connected to the first node and a second end electrically connected to the second node, and is configured to provide a selected inductance
Implementation Method 2
the selected inductance compensates for some or all of parasitic capacitance associated with the switching circuit
Data Source
AI summary
In some embodiments, a semiconductor chip device can include a semiconductor substrate having a switching circuit with a first node, and a plurality of layers configured to support the semiconductor substrate and to provide electrical connections for the switching circuit between a second node connectable to a location external to the semiconductor chip and the first node. The plurality of layers can include a redistribution layer, and a signal path can be implemented as a part of the redistribution layer. The signal path can have a first end electrically connected to the first node and a second end electrically connected to the second node, and be configured to provide a selected inductance.