High-Frequency Switch Circuit Layout for Lower Signal Loss
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Solution Overview
Problem
Signal leakage and loss occur between signal paths in high-frequency modules, particularly in switch circuits.
Innovation Solution
A high-frequency module design incorporating an IC chip with a mounting board, featuring a switch circuit with common and selection terminals, and signal paths that include both IC chip and mounting board wiring patterns, where the mounting board wiring patterns have a larger thickness and width to reduce signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If wiring patterns are made thicker and wider on the mounting board, then signal loss is reduced, but manufacturing complexity and cost increase
Solution Approach 1:
The signal path is segmented into two distinct parts: a first wiring pattern portion on the IC chip and a second wiring pattern portion on the mounting board. This segmentation allows each part to be optimized independently - the IC chip wiring can remain thin while the mounting board wiring is made thick and wide to reduce signal loss, without increasing overall manufacturing complexity.
Solution Approach 2:
Different wiring thicknesses are applied to different locations in the signal path. The mounting board wiring patterns are made locally thick and wide where signal loss occurs, while the IC chip wiring maintains its standard thickness. This localized optimization reduces signal loss only where needed without unnecessarily increasing manufacturing complexity throughout the entire system.
2Loss of energy
If signal paths are separated into IC chip and mounting board portions, then signal loss is reduced through optimized wiring, but device complexity increases
Solution Approach 1:
The IC chip and mounting board are combined into a single integrated high-frequency module assembly. The first wiring pattern portion on the IC chip and the second wiring pattern portion on the mounting board form a continuous signal path when the IC chip is mounted on the mounting board, creating a unified structure that reduces signal loss without requiring complex external connections.
Data Source
AI summary
In a high-frequency module, a plurality of signal paths of a switch circuit include a plurality of switching elements that switch a connection form between a plurality of common terminals and a plurality of selection terminals. At least one signal path among the plurality of signal paths of the switch circuit includes a first wiring pattern portion included in the IC chip, and a second wiring pattern portion included in a mounting board.