RF Module Switch Layout Across Substrate Surfaces for Isolation
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Solution Overview
Problem
The downsizing of radio frequency modules leads to reduced isolation characteristics due to electric, magnetic, or electromagnetic field coupling between components, resulting in deteriorated electrical characteristics such as noise figure (NF).
Innovation Solution
A radio frequency module design with switches and amplifiers disposed on opposite surfaces of the module substrate, utilizing a configuration that includes power amplifiers, low-noise amplifiers, and duplexers, with switches connected between input/output terminals and amplifiers to minimize coupling and maintain electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the radio frequency module is downsized by reducing the distance between components, then the module size is reduced, but electric field coupling, magnetic field coupling, or electromagnetic field coupling occurs between components, causing isolation characteristics to deteriorate and electrical characteristics (e.g., noise figure) to worsen
Solution Approach 1:
The patent applies dimensionality change by disposing switches on opposite surfaces of the module substrate (first principal surface and second principal surface). This spatial arrangement in three-dimensional space increases the effective distance between components that would otherwise be crowded on a single surface, thereby reducing electromagnetic coupling while maintaining compact module dimensions.
2Volume of moving object
If the distance between components is reduced to downsize the module, then manufacturing complexity is reduced, but field coupling between components increases, causing electrical characteristics to deteriorate
Solution Approach 1:
The patent utilizes the third dimension (depth) by placing components on both the first and second principal surfaces of the substrate. This vertical separation reduces the horizontal distance requirements and minimizes field coupling between components while achieving module downsizing.
3Area of stationary object
If components are arranged closer together for downsizing, then the module area is reduced, but isolation characteristics between components are reduced, causing noise figure to increase
Solution Approach 1:
The patent resolves the area-constraint contradiction by transitioning from a two-dimensional layout to a three-dimensional arrangement. By distributing components across both surfaces of the substrate, the effective isolation distance is increased without proportionally increasing the footprint area, thus maintaining electrical characteristics while achieving compact size.
Data Source
AI summary
A radio frequency module includes: a plurality of external connection terminals including at least one input terminal and at least one output terminal; at least one power amplifier; at least one low-noise amplifier; a first switch connected between the at least one input terminal and the at least one power amplifier; a second switch connected between the at least one output terminal and the at least one low-noise amplifier; and a module substrate including a first principal surface and a second principal surface on opposite sides of the module substrate. The first switch is disposed on one of the first principal surface and the second principal surface, and the second switch is disposed on the other of the first principal surface and the second principal surface.