RF Tag With Integrated And External Antenna Elements
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Solution Overview
Problem
The production of RF transponders on flexible substrates using print-and-etch processes is costly and generates hazardous waste, and aligning external antennas with integrated circuit packages is challenging due to size constraints and manufacturing complexities.
Innovation Solution
The RF tag design incorporates an integrated circuit package with an integrated antenna element and an external antenna element made from round wire wrapped at least partially around the IC package, providing inductive coupling and lateral support, eliminating the need for direct bonding and reducing the use of hazardous chemicals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If print-and-etch processes are used to create antenna wiring patterns on flexible substrates, then antenna functionality is achieved, but manufacturing cost increases and hazardous waste is generated
Solution Approach 1:
The patent extracts the antenna wiring pattern creation process from the substrate manufacturing process. Instead of printing and etching antennas directly onto flexible substrates, the invention uses separate rigid substrates with conductive traces that are pre-formed and then attached to the IC package, eliminating the need for print-and-etch processes in substrate fabrication.
Solution Approach 2:
The patent introduces an intermediary component - a rigid substrate with pre-formed conductive traces - that serves as a mediator between the IC package and the final antenna assembly. This rigid substrate acts as a carrier that holds the antenna wiring patterns in precise positions without requiring print-and-etch processes on the flexible substrate itself.
2Reliability
If print-and-etch processes are used to create antenna wiring patterns on flexible substrates, then antenna functionality is achieved, but hazardous waste is generated
Solution Approach 1:
The patent removes the print-and-etch process entirely from the manufacturing workflow by using pre-formed conductive traces on rigid substrates. This extraction eliminates the chemical etchants and photoresists that would otherwise be required, thereby eliminating hazardous waste generation.
Solution Approach 2:
The patent employs disposable rigid substrates with pre-formed conductive traces that are attached to IC packages and then discarded after use. These rigid substrates serve as single-use carriers for the antenna wiring patterns, eliminating the need for expensive and environmentally harmful print-and-etch processes.
3Reliability
If external antennas are aligned with integrated circuit packages, then antenna performance is improved, but manufacturing complexity increases due to size constraints
Solution Approach 1:
The patent performs preliminary alignment by pre-forming conductive traces on rigid substrates in precise positions before the IC packages are assembled. The rigid substrate is prepared in advance with antenna wiring patterns that are already positioned to match the IC package footprint, eliminating complex alignment operations during final assembly.
Solution Approach 2:
The rigid substrate with pre-formed conductive traces serves as an intermediary that simplifies the alignment process. By preparing the antenna wiring patterns on a rigid substrate in advance, the substrate acts as a template that guides the placement and connection to the IC package, reducing manufacturing complexity.
4Reliability
If wire is wrapped around IC package to form external antenna element, then antenna effectiveness is improved through close proximity, but structural support requirements increase
Solution Approach 1:
The patent introduces the IC package itself as an intermediary structural element that provides support for the wrapped wire antenna. The wire is wrapped around the IC package body, which acts as a form holder and structural support, eliminating the need for additional support structures or mounting fixtures.
Solution Approach 2:
The IC package serves multiple functions: it houses the integrated circuit, provides electrical connections, and acts as a structural form holder for the external antenna wire. By wrapping the wire around the IC package, the package's structural integrity is utilized to support the antenna element, reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, eliminates hazardous chemical use, and achieves optimal read range by ensuring close proximity of the external antenna to the integrated antenna without the limitations of print-and-etch technologies.
Implementation Method 1
The external antenna element is inductively coupled to the integrated antenna element
Data Source
AI summary
A disclosed RF tag includes a substrate and an integrated circuit (IC) package disposed on the substrate. The IC package has an integrated antenna element coupled to circuitry of the IC package. The RF tag also includes an external antenna element of round wire having at least one half turn disposed against two or more surfaces of the IC package. The external antenna element is inductively coupled to the integrated antenna element, and the IC package laterally supports the at least one half turn of the external antenna element.