RF Circuit Temperature Correction Using Dual-Die Sensing
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Solution Overview
Problem
Radio-frequency (RF) circuits face performance variations due to temperature changes, leading to issues like gain and phase changes in amplifiers, which existing architectures struggle to accurately monitor and correct across different semiconductor dies.
Innovation Solution
A dual-die architecture where one die includes a radio-frequency circuit and a sensor, and another die includes a control circuit with its own sensor, allowing for cross-chip temperature sensing and adjustment of the RF circuit's operation, including gain and phase adjustments of power amplifiers based on temperature measurements from multiple sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If temperature sensing is implemented on the same die as the RF circuit, then temperature measurement is simplified, but measurement precision deteriorates due to thermal coupling and reference inaccuracies
Solution Approach 1:
The patent divides the temperature sensing function across two separate dies: one die contains the RF circuit with its local temperature sensor, while another die contains the control circuit with its own temperature sensor. This segmentation allows each sensor to independently measure temperature at its respective location without thermal interference, resolving the contradiction between ease of implementation and measurement precision.
Solution Approach 2:
The control circuit die acts as an intermediary that receives temperature data from both the RF circuit die sensor and its own sensor, processes this information, and generates correction signals. This intermediary structure enables accurate temperature referencing by comparing temperatures at different locations while maintaining simple sensor implementation on each die.
2Device complexity
If a single die architecture is used for RF circuit and control circuit, then device complexity is reduced, but reliability deteriorates due to inability to accurately monitor temperature variations across different locations
Solution Approach 1:
The patent segments the RF circuit and control circuit onto separate dies, each with its own temperature sensor. This segmentation improves reliability by enabling independent temperature monitoring at each functional block, allowing accurate detection of location-specific temperature variations that would be missed in a single-die architecture.
Solution Approach 2:
The system dynamically adjusts RF circuit operating parameters (gain, phase, frequency) based on temperature measurements from both dies. By monitoring temperature as a changing parameter at multiple locations and applying real-time corrections, the system maintains reliable performance despite temperature variations, overcoming the limitations of single-die thermal monitoring.
3Device complexity
If temperature correction is not applied, then device simplicity is maintained, but performance stability deteriorates due to gain and phase variations
Solution Approach 1:
The patent implements a feedback mechanism where temperature sensors on both dies continuously monitor temperature, the control circuit processes this temperature information, and generates correction signals that are applied to the RF circuit. This closed-loop feedback system automatically compensates for temperature-induced gain and phase variations, ensuring performance stability while maintaining relatively simple circuit designs.
Solution Approach 2:
The system performs preliminary temperature measurement and correction calculations before RF signal transmission. By measuring temperature at both dies and pre-computing correction factors based on characterized temperature dependencies, the system proactively compensates for thermal effects before they degrade performance, maintaining stability without adding complex real-time adjustment circuitry.
Data Source
AI summary
In some embodiments, a radio-frequency system can include a die having a semiconductor substrate and including a radio-frequency circuit and a sensor implemented thereon. The radio-frequency system can further include another die having a semiconductor substrate and including a control circuit for controlling the radio-frequency circuit and a sensor implemented thereon. The control circuit can be configured to receive sensed information from the sensor of the die with the radio-frequency circuit and sensed information from the sensor of the die with the control circuit, and to be capable of adjusting operation of the radio-frequency circuit based on the sensed information from either or both of the sensors. In some embodiments, the radio-frequency system can be implemented as part of a packaged module.