RF Module Terminal Layout for Isolation in Dense Multiband Packaging
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Solution Overview
Problem
In multiband communication devices, achieving sufficient isolation between input and output terminals is challenging due to increasing mounting density of circuit elements and reduced size of radio-frequency modules, leading to potential deterioration of signal isolation.
Innovation Solution
A radio-frequency module configuration with strategically positioned input and output switches and filters on a multilayer substrate, where terminals are disposed to maximize separation and utilize electromagnetic shielding, ensuring effective isolation through distinct terminal and wiring pattern arrangements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the radio-frequency module is reduced and mounting density is increased, then the module size decreases, but the isolation between input and output terminals deteriorates
Solution Approach 1:
The patent utilizes the third dimension (vertical layering) by disposing input and output terminals on different layers of a multilayer substrate. This spatial separation in the vertical dimension maintains effective isolation between terminals while allowing horizontal mounting density to increase, thus resolving the contradiction between miniaturization and isolation maintenance.
Solution Approach 2:
The patent segments the terminal arrangement by separating input terminals and output terminals into distinct locations on different layers. This segmentation prevents interference between input and output signals while allowing compact overall module design, addressing the isolation deterioration issue without sacrificing miniaturization benefits.
2Productivity
If circuit elements are densely mounted to increase performance, then the mounting density increases, but the isolation between input and output sides deteriorates
Solution Approach 1:
By moving the isolation strategy from the horizontal plane to the vertical dimension through multilayer construction, the patent allows high mounting density on each layer while maintaining terminal isolation through layer separation. This enables performance enhancement via dense component placement without compromising signal isolation.
Solution Approach 2:
The patent introduces ground layers and shielding structures as intermediary elements between input and output terminals on different layers. These intermediary components provide electromagnetic shielding and maintain isolation even when circuit elements are densely mounted on the same layers, thus preserving reliability while enabling high-performance dense packaging.
Data Source
AI summary
A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.