Integrated RF Transceiver Array Groups for 5G Carrier Aggregation

The patent merges multiple RF transceiver chip modules operating in different frequency ranges (sub-6GHz and mm-Wave) onto a single integrated chip. This consolidation maintains the capability for carrier aggregation across multiple frequency bands while significantly reducing the total area occupied by eliminating the need for separate chip modules and reducing inter-chip interconnect requirements.

The integrated transceiver chip is designed to perform multiple functions across different frequency ranges simultaneously. A single chip structure supports both sub-6GHz and mm-Wave operations, enabling carrier aggregation, MIMO, and beamforming across diverse frequency bands, thereby replacing multiple specialized chip modules with one universal transceiver unit.

The patent combines multiple RF transceiver chip modules into a single integrated chip that supports multiple frequency ranges. This merging reduces the total power consumption by eliminating redundant support circuits, reducing inter-chip communication overhead, and enabling more efficient power management across the unified transceiver structure while maintaining adaptability to different frequency bands.

The universal transceiver chip is designed to operate across multiple frequency ranges (sub-6GHz and mm-Wave) with a single integrated architecture. This multi-functional design enables the system to adapt to different frequency bands and carrier aggregation configurations while consuming less power compared to multiple separate chip modules, as the unified structure shares common functional blocks and control logic.

The patent merges multiple transceiver chip modules that would traditionally be implemented on separate printed circuit board components into a single integrated chip structure. This consolidation achieves both frequency range coverage and manufacturing efficiency by eliminating the need for complex multi-chip module assembly, reducing inter-chip interconnects, and enabling standard semiconductor fabrication processes for mass production.

The integrated transceiver chip provides universal support for multiple frequency ranges (sub-6GHz and mm-Wave) within a single device. This multi-functional integration simplifies the manufacturing process compared to assembling multiple specialized chip modules on a printed circuit board, as the unified chip can be fabricated using standard semiconductor processes and requires fewer assembly steps and inter-chip connections.