RF Transceiver Connection Assembly for Flexible Optical Module Layout

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Solution Overview

Problem

The existing radio frequency transceivers face constraints in circuit layout due to the proximity of the baseband circuit to the optical module interface, leading to increased hardware costs, space occupation, and instability from heat generation, necessitating additional cooling units.

Innovation Solution

Implementing a connection assembly with a cable to space the optical module interface and baseband circuit by a specific distance, allowing for flexible circuit layout and natural heat dissipation without the need for cooling units, while decoupling the layout constraints.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the baseband circuit is located close to the optical module interface to reduce transmission loss, then signal transmission quality is improved, but heat from the baseband circuit causes the optical module interface to be burnt and affects working stability

Engineering Contradiction:

Improvesignal transmission qualityVSAvoidworking stability of optical module interface

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The patent divides the connection path into two segments: a PCB routing segment for signal transmission and a thermal isolation segment for heat management. The optical module interface is positioned at the bottom of the container away from the baseband circuit, with PCB routing connecting them, creating a physical separation that segments the thermal and electrical functions.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces an intermediate cooling unit positioned between the baseband circuit and the optical module interface. This cooling unit acts as a mediator that removes heat generated by the baseband circuit before it can reach the optical module interface, thereby protecting the interface from thermal damage while maintaining signal transmission quality.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If a cooling unit is introduced to protect the optical module interface from heat, then working stability is improved, but hardware costs increase and extra layout space is occupied

Engineering Contradiction:

Improveworking stability of optical module interfaceVSAvoidhardware costs and layout space

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the cooling function with the existing structural elements of the radio frequency transceiver. The cooling unit is integrated into the bottom wall structure of the container, combining thermal management with the mechanical housing design, thereby reducing additional hardware costs and layout space requirements.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The bottom wall structure of the container serves multiple functions: it provides mechanical support, enables heat dissipation through its thermal conductivity, and houses the optical module interface. This multi-functionality reduces the need for separate dedicated cooling components, thereby reducing hardware complexity and space occupation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Loss of energy

If the baseband circuit is located at the bottom of the container close to the optical module interface, then transmission loss is reduced, but circuit layout flexibility is constrained

Engineering Contradiction:

Improvetransmission lossVSAvoidcircuit layout flexibility

Core Design Contradiction:

Loss of energyVSAdaptability or versatility

Solution Approach 1:

The patent utilizes the vertical dimension of the container by positioning the optical module interface at the bottom wall, allowing PCB routing to connect components in three-dimensional space rather than being constrained to a two-dimensional plane. This dimensional approach enables flexible circuit layout while maintaining short transmission paths for signal integrity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces hardware costs and space occupation by enabling flexible circuit layout and improving the stability of the optical module interface through natural heat dissipation, eliminating the need for cooling units and reducing power transmission losses.

Implementation Method 1

allowing for flexible circuit layout and natural heat dissipation without the need for cooling units

Methodology Applied

Scientific EffectHeat dissipation: Convection

Data Source

PatentUS12580655B2Radio frequency transceiver, connection assembly for radio frequency transceiver, and radio frequency transceiver system

Publication Date: 2026.03.17 HUAWEI TECH CO LTD

AI summary

A radio frequency transceiver includes a container. The container includes a circuit board and the connection assembly. A baseband circuit is disposed on the circuit board. The baseband circuit is configured to synthesize the first baseband signal, and decode the second baseband signal. The connection assembly includes a board-end connector, a cable, and at least one optical module interface. The board-end connector is configured to connect to the baseband circuit. A first end of the cable is configured to connect to the at least one optical module interface, and a second end of the cable is configured to connect to the board-end connector. Each optical module interface of the at least one optical module interface is configured to connect to an external optical module. According to the solutions provided by this radio frequency transceiver, a circuit layout can be more flexible, hardware costs can be reduced, and space can be saved.