RF Transceiver Integration on Planar Conductor Pattern
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Solution Overview
Problem
Existing radio frequency transmitting/receiving elements require costly packaging and placement processes, which can compromise reliability due to separate production of radar packages and antennas, leading to complex exterior arrangements and increased conduction losses.
Innovation Solution
A method integrating a radio frequency chip directly into an electrically insulating layer beneath a planar conductor pattern antenna structure, eliminating the need for separate housing and reducing transmission path lengths, thereby simplifying production and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the radar package is produced separately from the radar antenna, then the integrated circuit can be packaged and secured on the circuit board, but the production process becomes complex and reliability decreases
Solution Approach 1:
The patent merges the radar package and radar antenna into a single integrated structure. The conductor pattern structure serves dual purposes: as the antenna for electromagnetic radiation and as the circuit board for mounting the integrated circuit. This eliminates the need for separate production and placement processes, reducing complexity while improving reliability through direct integration.
2Ease of manufacture
If the radar package is arranged laterally alongside the conductor pattern, then the components can be secured on the circuit board, but the exterior arrangement becomes complex and conduction losses increase
Solution Approach 1:
The patent transitions from a lateral arrangement of components in the plane to a vertical integration where the integrated circuit is mounted directly on the conductor pattern structure. This dimensional change allows the antenna and package to occupy the same spatial footprint, reducing transmission path lengths and minimizing conduction losses while simplifying the exterior arrangement.
3Ease of manufacture
If a temporary rigid carrier is used during production, then the conductor pattern structure can be applied and the chip can be arranged, but an additional removal step is required
Solution Approach 1:
The temporary rigid carrier serves as an intermediary substrate that facilitates the production process. It provides a stable base for applying the conductor pattern structure and arranging the integrated circuit before final assembly. The carrier is removed after serving its purpose, having enabled precise positioning and assembly without permanently adding complexity to the final product.
Data Source
AI summary
A method for producing a radio frequency transmitting/receiving element comprising at least one radio frequency antenna and at least one radio frequency chip, and to a corresponding radio frequency transmitting/receiving element made by the method. The method comprises the following steps: providing a temporary rigid carrier; applying a conductor pattern structure comprising the antenna structure of the at least one radio frequency antenna and connection contacts—connected thereto via leads—for the at least one radio frequency chip; arranging the at least one radio frequency chip on the connection contacts of the conductor pattern structure; applying an electrically insulating layer on the conductor pattern structure, such that the at least one radio frequency chip is surrounded by the electrically insulating layer; and removing the temporary rigid carrier.