Intra-device RF Transceivers Using Substrate Waveguides
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Solution Overview
Problem
Current wireless communication systems face challenges in supporting high data rate communications due to the increasing complexity of chip layout and the need for more output pins and internal buses, particularly as integrated circuit sizes decrease and frequencies exceed 10 GHz, requiring innovative solutions for intra-device and inter-device communication.
Innovation Solution
The implementation of a substrate with intra-device local transceivers and wave guides to guide very high RF signals, allowing for wireless transmission of low power RF signals within the device and between devices, utilizing frequency conversion circuitry and dielectric regions to minimize interference and reduce power requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of output pins and internal buses is increased to support high data rate communications, then communication capability is improved, but chip layout complexity and difficulty increase
Solution Approach 1:
The patent replaces physical mechanical connections (pins and buses) with wireless electromagnetic field communication. Transceivers communicate via RF signals through dielectric regions, eliminating the need for complex physical trace routing and pin connections while maintaining high data rate capabilities.
Solution Approach 2:
The patent transitions from two-dimensional planar communication (through pins and traces on a flat chip) to three-dimensional volumetric communication by utilizing dielectric regions and electromagnetic wave propagation through the substrate, enabling signals to travel through the third dimension (vertical depth of the substrate).
2Volume of moving object
If the integrated circuit die size is decreased, then device miniaturization is achieved, but the challenge of developing internal buses and traces increases
Solution Approach 1:
The patent eliminates the need for internal buses and traces by replacing them with wireless transceivers that communicate through electromagnetic fields and dielectric regions, removing the constraint of physical space for signal routing within the miniaturized die.
Solution Approach 2:
The dielectric regions serve multiple functions: they provide structural support for the integrated circuit, act as insulation layers, and simultaneously function as waveguides for electromagnetic signal transmission, eliminating the need for separate dedicated signal pathways.
3Productivity
If very high RF signals are transmitted through space, then wireless communication capability is improved, but power consumption increases
Solution Approach 1:
The patent introduces dielectric regions as intermediaries that guide and confine electromagnetic waves between transceivers. These dielectric waveguides enable efficient signal transmission with lower power requirements compared to free-space propagation, as they reduce signal loss and enable more direct signal paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient high-frequency communication within and between devices, reducing the need for physical connections and minimizing interference, thus supporting future advancements in IC fabrication and data rate requirements.
Implementation Method 1
a wave guide formed within the substrate operable to guide very high radio frequency (RF) signals within the wave guide
Implementation Method 2
the first intra-device local transceiver is communicatively coupled to the first substrate local transceiver and is operable to wirelessly transmit low power RF signals through space to the second intra-device local transceiver
Data Source
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AI summary
A radio transceiver device includes circuitry for radiating electromagnetic signals at a very high radio frequency both through space, as well as through wave guides that are formed within a substrate material. In one embodiment, the substrate comprises a dielectric substrate formed within a board, for example, a printed circuit board. In another embodiment of the invention, the wave guide is formed within a die of an integrated circuit radio transceiver. A plurality of transceivers with different functionality is defined. Substrate transceivers are operable to transmit through the wave guides, while local transceivers are operable to produce very short range wireless transmissions through space. A third and final transceiver is a typical wireless transceiver for communication with remote (non-local to the device) transceivers.