Composite RF Waveguide Substrate with Tuned Conductor Thickness
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Solution Overview
Problem
Conventional RF waveguide substrates are limited by standard dielectric properties, forcing designers to choose substrates based on 'the least worst' option due to cost constraints, and multi-layered substrates are limited by the dielectric permittivity values of their constituents, restricting customizability of dielectric properties.
Innovation Solution
A composite substrate configuration featuring a first and second dielectric layer with a conductor layer of electrically conductive material, where the conductor layer's thickness is controlled to be smaller than 120% of the skin depth, allowing for precise tuning of the effective relative permittivity without being limited by the individual dielectric constants of the constituent materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional single layer substrate materials with standard dielectric properties are used, then manufacturing cost is reduced, but dielectric property customization is limited
Solution Approach 1:
The patent applies composite materials by stacking multiple dielectric layers with different relative permittivity values (e.g., SiO2 with εr=3.9, SiN with εr=7.5, Polyimide with εr=3.0) to create an effective dielectric substrate with customized properties. This allows achieving intermediate permittivity values (e.g., εreff=4.5) that are not available in single-layer substrates, resolving the contradiction between manufacturing ease and dielectric customization.
Solution Approach 2:
The patent changes physical parameters by varying the thickness ratios of constituent dielectric layers to control the effective relative permittivity. By adjusting the thickness parameters (e.g., h1, h2, h3 for different layers) while keeping material types fixed, the design achieves continuous tuning of dielectric properties without developing entirely new substrate materials, thus maintaining manufacturing simplicity while enabling customization.
2Adaptability or versatility
If conventional multi-layered dielectric substrates are used to achieve custom dielectric properties, then dielectric property customization is improved, but production cost increases
Solution Approach 1:
The patent reduces production cost by changing only the thickness parameters of standard dielectric layers rather than developing custom dielectric materials. By using commercially available dielectric materials (SiO2, SiN, Polyimide) and adjusting their thickness ratios, the patent achieves effective permittivity values (e.g., εreff=4.5, 6.0, 8.0) without incurring high R&D costs associated with custom substrate development.
Solution Approach 2:
The patent uses homogeneous dielectric materials (single-material layers) rather than complex composite materials, which simplifies manufacturing processes and reduces production costs. Each layer consists of a uniform dielectric material that can be deposited using standard fabrication techniques, avoiding the complexity and cost of creating truly heterogeneous composite substrates.
3Adaptability or versatility
If conventional multi-layered substrates are used, then a range of usable dielectric substrates can be obtained, but the dielectric permittivity values are limited by the minimum and maximum values of the layered stack
Solution Approach 1:
The patent achieves precise dielectric permittivity control by varying the thickness parameters of dielectric layers. The effective relative permittivity εreff is continuously可调 by changing the thickness ratios (h1/(h1+h2+h3), etc.), enabling precise control of dielectric properties within the range defined by the constituent materials' permittivity values.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of substrates with customizable dielectric properties over a wide range, including high relative permittivity values, without the constraints of conventional multi-layered substrates, facilitating flexible design and operation across various RF frequency ranges.
Implementation Method 1
a layer thickness of said at least one conductor layer is smaller than about 120 percent of a skin depth of said RF signals within said electrically conductive material of said conductor layer
Data Source
AI summary
Composite substrate for a waveguide for RF signals having a signal frequency, wherein said composite substrate comprises at least a first layer of dielectric material and a second layer of dielectric material, and at least one conductor layer of an electrically conductive material arranged between said first layer and said second layer, wherein a layer thickness of said at least one conductor layer is smaller than about 120 percent of a skin depth of said RF signals within said electrically conductive material of said conductor layer.