Radio Frequency Yarn Module for Textile Integration
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Solution Overview
Problem
Existing radio frequency identification (RFID) technologies in consumer products face challenges in integrating flexible and durable electronic components that can withstand harsh environments, such as high temperatures, water, and alkaline or acidic conditions, while maintaining signal detection capabilities.
Innovation Solution
A radio frequency yarn module comprising a flexible substrate with conductive layers and a radio frequency chip, encapsulated by packaging adhesives that provide high temperature resistance, water washing resistance, and acid-and-alkali resistance, allowing the module to be flexible and suitable for integration into fabrics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If RFID tags are integrated into consumer products to enable IoT connectivity, then data exchange and location tracking capabilities are improved, but the device becomes more complex and harder to manufacture
Solution Approach 1:
The patent merges the RFID tag with a yarn structure to create a flexible, wearable RFID module. The conductive layers are integrated directly into the yarn substrate, combining the electronic component with the textile structure, thereby reducing overall device complexity while maintaining IoT functionality
Solution Approach 2:
The patent uses flexible substrates and thin film encapsulation layers to create a bendable RFID module that can be integrated into fabric. This flexible design simplifies manufacturing compared to rigid RFID tags while enabling new application scenarios in wearable technology
2Adaptability or versatility
If the RFID module is made flexible for fabric integration, then adaptability to textile applications is improved, but protection against harsh environments (high temperature, water, chemicals) deteriorates
Solution Approach 1:
The patent employs composite material structures combining flexible substrates with protective encapsulation layers. Multiple material layers are stacked to provide both flexibility for fabric integration and chemical/thermal resistance, resolving the contradiction between softness and durability
Solution Approach 2:
The RFID components are nested within multiple protective layers including encapsulation adhesives and protective coatings. This nested structure protects the sensitive electronics from environmental factors while maintaining the overall flexible form factor needed for textile applications
3Reliability
If protective encapsulation is added to withstand harsh environments, then reliability and durability are improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The protective encapsulation layers are applied in advance during the manufacturing process, before the RFID module is integrated into the final product. This preliminary protection simplifies subsequent assembly steps and ensures reliability from the outset without adding complex post-processing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module maintains signal detection capabilities after exposure to high temperatures, water, and alkaline or acidic conditions, making it suitable for use in textile applications and enhancing its durability and service life.
Implementation Method 1
The first packaging adhesive covers the radio frequency assembly, so as to make the radio frequency assembly be disposed between the first flexible substrate and the first packaging adhesive
Implementation Method 2
The first pin is electrically connected to the first conductive layer, and the second pin is electrically connected to the second conductive layer
Data Source
AI summary
A radio frequency yarn module includes a first flexible substrate, a radio frequency assembly, and a first packaging adhesive. The first flexible substrate is strip shaped and has a thickness ranging from 40 μm to 60 μm. The radio frequency assembly is disposed on the first flexible substrate and includes a first conductive layer, a second conductive layer, and a radio frequency chip. Each of the first and the second conductive layers is disposed on the first flexible substrate and has a thickness ranging from 3 μm to 10 μm. Extending paths of the first and the second conductive layers are respectively same as extending paths of a first and a second portions of the first flexible substrate. The radio frequency chip is disposed on the first conductive layer and the second conductive layer. The first packaging adhesive covers the radio frequency assembly.