RFIC Module Bonding Layer for Bump Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The reliability of radio-frequency integrated circuit (RFIC) components in electronic device modules is compromised by external physical impacts and temperature variations due to their small bump form, which leads to reduced bump bonding reliability.
Innovation Solution
An electronic device module design featuring a first and second board with a bonding layer extending into the gap between the boards and the RFIC chip, including an insulating protection layer with a trench to contain the bonding resin, which fills the gaps and enhances adhesion, using an insulating resin for the bonding layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If RFIC components are implemented as CSP package with fine pitch and small bump form to down-size the module, then the module size is reduced, but the reliability of bump bonding portion is deteriorated by external physical impacts and temperature variations
Solution Approach 1:
The patent applies beforehand cushioning by introducing a bonding layer that extends into the gap between the board and RFIC component before external impacts or temperature variations occur. This bonding layer acts as a preventive measure, providing mechanical support and stress distribution to protect the vulnerable bump bonding portions from future physical impacts and thermal stress, thereby maintaining reliability while preserving the compact CSP design.
2Reliability
If the bonding layer extends into the gap between the board and RFIC chip to improve adhesion and reliability, then the bump bonding reliability is improved, but the device complexity increases
Solution Approach 1:
The bonding layer serves multiple functions simultaneously: it bonds the second board to the first board, fills gaps between components, provides mechanical support to protect bump bonding portions, and extends into gaps to enhance adhesion. By making the bonding layer multi-functional, the patent improves reliability without requiring additional separate components, thereby avoiding increased device complexity.
3Reliability
If an insulating protection layer with trench is added to contain the bonding resin, then the bonding layer containment is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The insulating protection layer with trench is formed in advance during board fabrication, before the bonding layer is applied. This preliminary action ensures that the trench structure is already in place to guide and contain the bonding resin, reducing the risk of improper bonding layer distribution. By pre-forming the containment structure, the patent improves bonding resin containment while managing manufacturing precision requirements through standardized board fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the reliability of RFIC components by increasing the solder adhesion and protecting against physical impacts and temperature changes, maintaining module integrity and performance.
Implementation Method 1
a bonding layer disposed in a gap between the first board and the second board and extending into a gap between the second side of the first board and the second electronic device, the bonding layer bonding the second board and the second electronic device to the first board
Implementation Method 2
using an insulating resin for the bonding layer
Data Source
AI summary
An electronic device module includes a first board including a first side and a second side facing in opposite directions, the first side of the first board being configured to have a first electronic device mounted thereon; a second board adhered to the second side of the first board, and including a device accommodating portion that is a space formed by removing a central portion of the second board; a second electronic device disposed in the device accommodating portion and mounted on the second side of the first board so that the second electronic device is adjacent to an internal edge side of the second board defining a boundary of the device accommodating portion; and a bonding layer disposed in a gap between the first board and the second board and extending into a gap between the second side of the first board and the second electronic device, the bonding layer bonding the second board and the second electronic device to the first board.