Embedded RFIC Module with Interposed Duplexer for Noise Isolation

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Solution Overview

Problem

Conventional high-frequency circuit modules fail to achieve sufficient miniaturization and high installation density due to noise interference from power amplifier ICs to receiving circuits, and duplexers are often spaced apart, leading to signal leakage and increased signal wire lengths.

Innovation Solution

A high-frequency circuit module design featuring a circuit board with alternately stacked insulating and conductive layers, where the high-frequency IC and power amplifier IC are embedded, and a duplexer is placed between them to separate transmission and reception signals, reducing noise interference and signal wire lengths, with the duplexer potentially embedded in the board for enhanced heat dissipation and shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the power amplifier IC is disposed immediately adjacent to the high-frequency IC for miniaturization, then the installation density is improved, but noise or leakage signal from the power amplifier IC enters the receiving circuit causing signal interference

Engineering Contradiction:

Improveinstallation densityVSAvoidnoise interference

Core Design Contradiction:

Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

A duplexer is introduced as an intermediary component between the power amplifier IC and the high-frequency IC. The duplexer separates transmission and reception signals, preventing noise and leakage signals from the power amplifier from entering the receiving circuit of the high-frequency IC, while still allowing the compact adjacent arrangement of components

Inventive Principle:

Principle #24Intermediary (Mediator)

2Area of stationary object

If the signal wire for received signal passes through the vicinity of the power amplifier IC due to miniaturization, then the circuit board area is reduced, but the received signal is contaminated by noise from the power amplifier IC

Engineering Contradiction:

Improvecircuit board areaVSAvoidsignal contamination

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The duplexer acts as a mediator that filters and separates signals before they reach the high-frequency IC. By positioning the duplexer between the antenna and the high-frequency IC's receiving circuit, it prevents noise from contaminating the received signal even when signal wires pass near the power amplifier IC

Inventive Principle:

Principle #24Intermediary (Mediator)

3Object-affected harmful factors

If the duplexer is disposed distant from the high-frequency IC and power amplifier IC, then noise interference is reduced, but the signal wire length increases causing power loss

Engineering Contradiction:

Improvenoise interferenceVSAvoidpower loss

Core Design Contradiction:

Object-affected harmful factorsVSLoss of energy

Solution Approach 1:

The duplexer serves as an effective intermediary that provides noise isolation without requiring large distances. Its filtering capability allows it to be positioned close to both the power amplifier IC and high-frequency IC, maintaining short signal wires and minimizing power loss while still preventing noise interference

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design minimizes noise interference, reduces signal wire lengths, and enhances heat dissipation, facilitating miniaturization and high-density integration while maintaining signal integrity.

Implementation Method 1

a duplexer installed between the high-frequency IC and the power amplifier IC to separate the transmission signal output from the power amplifier IC and input to an antenna and a received signal output from the antenna and input to the high-frequency IC from each other

Methodology Applied

Scientific EffectFrequency-selective filtering: Filter (electronic)

Implementation Method 2

a circuit board including an insulating layer and a conductive layer that are alternately stacked

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 3

at least one of the high-frequency IC and the power amplifier IC is embedded in the circuit board

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9099979B2High-frequency circuit module

Publication Date: 2015.08.04 TAIYO YUDEN KK

AI summary

A high-frequency circuit module having a high mounting density is provided. The high-frequency circuit module includes an RFIC configured to transmit and receive a high-frequency signal, a power amplifier IC configured to amplify a transmission signal output from the RFIC, and duplexers configured to separate the transmission signal output from the power amplifier IC and input to an antenna and a received signal from the antenna and input to the RFIC from each other, wherein at least one of the RFIC and power amplifier IC is embedded in the circuit board, and the duplexers are disposed between the RFIC and the power amplifier IC.