RFIC Module Antenna Bonding via Insulating Adhesive Layer
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Solution Overview
Problem
Existing wireless communication devices with RFIC elements and antennas experience variations in contact resistance and electrical characteristics due to the lack of a secure fixation between the terminal electrodes and the radiation conductor, leading to inconsistent communication performance.
Innovation Solution
A wireless communication device design where the RFIC module's terminal electrodes are bonded to an antenna member using an insulating adhesive layer, with the distance from the RFIC module's surface to the terminal electrodes being greater than the adhesive layer's thickness, ensuring stable electrical connections and reduced variations in electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the terminal electrode and radiation conductor are not fixed together, then the device structure is simpler and easier to manufacture, but the contact resistance varies and electrical characteristics become unstable
Solution Approach 1:
The patent introduces a seal as an intermediary component that covers the terminal electrode and maintains a fixed distance from the radiation conductor. This seal acts as a mediator that provides stable electrical characteristics without requiring direct fixation between the terminal electrode and radiation conductor, thus maintaining ease of manufacture while improving reliability
Solution Approach 2:
The patent controls the distance parameter between the seal and the radiation conductor to be within a specific range (0.1mm to 3mm). By optimizing this distance parameter, the invention achieves stable electrical characteristics and reduced contact resistance variation while maintaining the simple structure of not fixing the terminal electrode directly to the radiation conductor
2Reliability
If the terminal electrode is fixed to the radiation conductor, then the electrical connection is more stable, but the device structure becomes more complex and manufacturing becomes more difficult
Solution Approach 1:
The seal serves as an intermediary component that provides stable electrical connection characteristics without requiring direct fixation. By positioning the seal at a controlled distance from the radiation conductor, the invention achieves reliable electrical connection while avoiding the complexity of fixing mechanisms
Solution Approach 2:
The seal functions as a thin film or shell structure that covers the terminal electrode and maintains precise spacing from the radiation conductor. This flexible shell approach provides stable electrical characteristics without the need for rigid fixation structures, thereby reducing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively stabilizes the electrical connection between the RFIC module and the antenna, minimizing variations in electrical characteristics and enhancing the reliability and handleability of the wireless communication device.
Implementation Method 1
bonded to each other by an insulating first adhesive layer interposed therebetween
Implementation Method 2
between the first terminal electrode and the first coupling portion and between the second terminal electrode and the second coupling portion, a distance from a surface of the RFIC module in contact with the first adhesive layer to the first and second terminal electrodes is larger than a thickness of the first adhesive layer
Data Source
AI summary
A wireless communication device is provided that includes an RFIC module in which an RFIC chip and first and second terminal electrodes are incorporated, and an antenna member including an antenna base material and antenna patterns including first and second coupling portions. The RFIC module and the antenna member are bonded to each other via an insulating first adhesive layer. Between the first terminal electrode and the first coupling portion and between the second terminal electrode and the second coupling portion, a distance t1 from a surface of the RFIC module in contact with the first adhesive layer to the first and second terminal electrodes is larger than a thickness t2 of the first adhesive layer.