RFIC Module Impedance Matching Circuit Reduces Coil Coupling
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Solution Overview
Problem
Existing RFIC modules experience unwanted coupling between coils in the matching circuit, leading to changes in the characteristics of the RFIC module and RFID tag, especially when designed to be thinner and smaller, and when multiple modules are adjacent to each other.
Innovation Solution
The RFIC module incorporates a substrate with an RFIC chip, terminal electrodes, and an impedance matching circuit comprising inductors configured as a single coil-shaped pattern, with specific connections and layering to reduce unwanted coupling and minimize the region occupied by the coils, including a first inductor, second inductor, third inductor, and fourth inductor connected in a way that defines a single coil pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the RFIC module is designed to be thinner and smaller, then the size of the module is reduced, but unwanted coupling between coils increases
Solution Approach 1:
The patent transitions from planar coil arrangements to a three-dimensional stacked configuration where coils are arranged on different layers of the substrate. This vertical stacking allows coils to be closely spaced while maintaining electrical isolation through the substrate thickness, thereby reducing unwanted coupling while achieving compact module dimensions.
Solution Approach 2:
The substrate serves as an intermediary element between adjacent coils, providing both mechanical support and electromagnetic isolation. The substrate material and structure act as a mediator that prevents direct coupling between coils while allowing the module to maintain a thin profile.
2Productivity
If multiple RFIC modules are placed adjacent to each other, then the density of modules increases, but unwanted coupling between modules increases
Solution Approach 1:
By arranging coils vertically on different layers rather than horizontally adjacent to each other, the patent enables higher module density in the planar direction while maintaining electromagnetic isolation through the vertical layering structure.
Solution Approach 2:
The matching circuit is segmented into multiple independent coil components arranged on different layers. This segmentation allows each coil to be independently positioned and optimized, reducing interference between adjacent modules while maintaining high density.
3Area of stationary object
If coils are placed close to each other to reduce area, then the area of the matching circuit is reduced, but unwanted coupling between coils increases
Solution Approach 1:
The patent utilizes the third dimension (vertical stacking on different substrate layers) to achieve compact area occupation. Coils are arranged vertically rather than horizontally, allowing dense packing while maintaining electromagnetic isolation through the substrate thickness between layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces unwanted coupling between coils, minimizes the area required for the matching circuit, and maintains the characteristics of the RFIC module and RFID tag, while allowing for efficient impedance matching with the antenna.
Implementation Method 1
The impedance matching circuit includes a first inductor, a second inductor, a third inductor, and a fourth inductor that are configured by a conductor pattern provided at the substrate
Implementation Method 2
an antenna side first terminal electrode and an antenna side second terminal electrode are provided at the substrate and are each configured to be directly connected or capacitively coupled to an antenna
Data Source
AI summary
An RFIC module is provided that includes an RFIC and an impedance matching circuit connected to an RFIC side first terminal electrode, an RFIC side second terminal electrode, an antenna side first terminal electrode and an antenna side second terminal electrode. The impedance matching circuit includes a first inductor, a second inductor, a third inductor, and a fourth inductor, and a conductor pattern that configures the first inductor, the second inductor, the third inductor, and the fourth inductor as a single coil-shaped pattern.