RFIC Module Stacked Coil Design for Reduced Magnetic Blocking
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Solution Overview
Problem
Existing RFIC modules face challenges in downsizing while maintaining communication performance, as the IC chip blocks the coil opening, leading to reduced magnetic coupling and decreased communication efficiency.
Innovation Solution
The RFIC module design features a stacked coil with a planar coil having an open portion that overlaps the IC chip, positioned closer to one side surface than the other, reducing blocking and maintaining the coil opening area, and a planar conductor with a recess to enhance radiation and magnetic coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the coil opening is reduced to downsize the RFIC module, then the size of the module is reduced, but the communication performance deteriorates due to magnetic blocking by the IC chip
Solution Approach 1:
The patent transitions from a planar coil configuration to a three-dimensional stacked coil structure. The stacked coil comprises multiple coil windings arranged in different layers (first winding in first layer, second winding in second layer, third winding in third layer), creating a vertical dimension that allows the coil to maintain effective magnetic coupling area while reducing the planar footprint and overall module size.
Solution Approach 2:
The patent implements a nested structure where multiple coil windings are positioned within each other in the vertical dimension. The first, second, and third windings are arranged in stacked layers, with each winding nested within the projection area of the others when viewed from above, maximizing space utilization and maintaining magnetic flux while minimizing the module's planar dimensions.
2Volume of moving object
If the coil opening is reduced to downsize the RFIC module, then the size of the module is reduced, but the coil opening is more severely blocked by the IC chip
Solution Approach 1:
The stacked coil structure extends the magnetic flux path into the vertical dimension, allowing magnetic fields to couple through multiple layers rather than being confined to a single planar layer. This dimensional transition reduces the impact of planar blocking by the IC chip while maintaining effective magnetic coupling.
Solution Approach 2:
The coil is segmented into multiple discrete windings (first, second, and third windings) positioned in different vertical layers. This segmentation allows each winding to contribute to the overall magnetic flux while the stacked arrangement minimizes the blocking effect of the IC chip on any single winding's magnetic path.
3Reliability
If the coil opening area is maintained to improve communication performance, then the size of the RFIC module increases
Solution Approach 1:
The patent resolves this contradiction by moving the coil structure into the vertical dimension through stacking multiple windings in different layers. This allows the effective magnetic coupling area to be maintained across multiple layers while the planar footprint and overall module volume are reduced compared to a single large planar coil.
Solution Approach 2:
The nested arrangement of multiple windings in stacked layers allows the magnetic flux to be generated and coupled through a compact vertical structure. The windings are nested within each other's projection areas, maintaining effective magnetic coupling area while minimizing the module's planar dimensions and overall size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a downsized RFIC module with improved communication performance by minimizing coil opening blocking and optimizing magnetic flux, enabling smaller RFID tags and articles with enhanced communication capabilities.
Implementation Method 1
The stacked coil and the planar coil are electromagnetically coupled to each other
Data Source
AI summary
An RFIC module includes an insulating substrate; a stacked coil formed into a plurality of layers in the insulating substrate and formed along four side surfaces of the insulating substrate; an RFIC mounted on a first planar surface of the insulating substrate; and a planar coil disposed on a second planar surface of the insulating substrate, that partially has an open portion, and that overlaps the stacked coil in a plan view of the insulating substrate. The stacked coil is connected to the RFIC. The RFIC is disposed at a position close to a first side surface and close to a third side surface of the insulating substrate. A part of the RFIC overlaps the stacked coil in a plan view of the insulating substrate. The open portion of the planar coil is formed at a position close to the first side surface.