RFIC Antenna Matching Layout to Cut Switch Insertion Loss

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Solution Overview

Problem

The existing configurations of radio-frequency integrated circuits (RFICs) for radio transceivers face issues with receiving sensitivity due to insertion loss from semiconductor switches, and transmission efficiency is compromised due to increased power consumption when these switches are used between the antenna matching circuit and the transformer.

Innovation Solution

Incorporating a semiconductor switch in parallel with the impedance matching circuit between the antenna connection terminal and the receiving unit, allowing the switch to be controlled for optimal impedance matching and resonance, thereby reducing insertion loss and enhancing both receiving sensitivity and transmission efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a semiconductor switch is connected between the antenna matching circuit and the low-noise amplifier, then the switch can be used for signal routing, but receiving sensitivity deteriorates due to insertion loss

Engineering Contradiction:
Improvesignal routing capabilityVSAvoidreceiving sensitivity
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The semiconductor switch is extracted from the receiving signal path and placed only in the transmitting signal path. The matching circuit is separated into a transmitting matching circuit and a receiving matching circuit, with the switch connected only to the transmitting side, thereby eliminating insertion loss from the receiving path while preserving routing functionality on the transmitting side.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The single matching circuit is segmented into separate transmitting and receiving matching circuits. This segmentation allows independent optimization of each path - the transmitting path includes the switch for routing control, while the receiving path is kept simple and direct to minimize loss and maximize sensitivity.

Inventive Principle:
Principle #1Segmentation

2Ease of operation

If a semiconductor switch is connected between the antenna matching circuit and the transformer, then transmission routing is enabled, but transmission efficiency decreases due to insertion loss leading to increased power consumption

Engineering Contradiction:
Improvetransmission routing capabilityVSAvoidpower consumption
Core Design Contradiction:
Ease of operationVSUse of energy by moving object

Solution Approach 1:

The semiconductor switch is extracted from the main transmitting signal path and repositioned to control the receiving path instead. The transmitting signal flows directly through the matching circuit to the transformer without passing through the switch, eliminating insertion loss and reducing power consumption while the switch still provides routing control for the receiving function.

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of manufacture

If external parts are replaced by on-chip parts, then cost is reduced and space is saved, but circuit complexity increases

Engineering Contradiction:
Improveintegration cost and spaceVSAvoidon-chip circuit complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The integrated front-end circuit is segmented into distinct transmitting and receiving sections with separate matching circuits. This segmentation organizes the complex on-chip integration into manageable functional blocks, making the design more systematic and easier to manufacture while maintaining the space and cost benefits of integration.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration prevents deterioration in receiving sensitivity and decreases transmission efficiency, resulting in a reduced loss front-end section compared to conventional designs.

Implementation Method 1

a circuit to be used for impedance matching is connected... a semiconductor switch is connected in parallel with this circuit

Methodology Applied
Scientific EffectImpedance matching: Electrical Resistance

Data Source

PatentUS10305533B2Semiconductor device
Publication Date: 2019.05.28 RENESAS ELECTRONICS CORP
  • US10305533B2 patent drawing
  • US10305533B2 patent drawing
  • US10305533B2 patent drawing

AI summary

In an RFIC provided in a semiconductor device according to an embodiment, a low-noise amplifier (41) for reception and a power amplifier (11) for transmission are connected to a common antenna connection terminal (5). Between the antenna connection terminal (5) and an LNA (41), a circuit (31) is connected to be used for impedance matching, and a semiconductor switch (SW1) is connected in parallel with the circuit (31).