RFIC Tag Manufacturing Density Adjustment

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Solution Overview

Problem

Current RFID tag manufacturing methods using carrier tapes face challenges in increasing productivity and ensuring attachment position accuracy when continuously attaching RFIC elements to antenna substrates.

Innovation Solution

The method involves arranging RFIC elements in a housing tool at a first density and extracting a group with a lower second density matching the antenna patterns on the substrate, using a transfer sheet and mask with through-holes to maintain alignment and accuracy during disposition.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If RFIC elements are continuously attached one by one to the antenna substrate, then attachment position accuracy can be ensured, but productivity increases are limited

Engineering Contradiction:
Improveattachment position accuracyVSAvoidmanufacturing speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent segments the RFIC elements into groups corresponding to antenna pattern groups on the substrate. Instead of attaching individual RFIC elements one by one, multiple RFIC elements are attached as a group in a single operation, thereby improving productivity while maintaining attachment position accuracy through the grouped arrangement.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent prepares the RFIC elements in advance by arranging them in a housing tool at a first arrangement density that corresponds to the antenna pattern arrangement on the substrate. This preliminary arrangement allows for efficient group extraction and attachment, improving both productivity and position accuracy.

Inventive Principle:
Principle #10Preliminary action

2Productivity

If RFIC elements are arranged at high density in the housing tool, then productivity can be increased, but attachment position accuracy may deteriorate

Engineering Contradiction:
Improvenumber of RFIC elements processedVSAvoidattachment position accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent employs a dynamic arrangement strategy where RFIC elements are arranged at a first arrangement density in the housing tool that is higher than the second arrangement density on the substrate. During the extraction and attachment process, the system dynamically selects and extracts only the necessary RFIC element groups at the appropriate second density, thereby achieving both high productivity and accurate attachment positions.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS10713552B2RFID tag manufacturing method, RFID tag manufacturing device, and transfer sheet manufacturing method
Publication Date: 2020.07.14 MURATA MFG CO LTD
  • US10713552B2 patent drawing
  • US10713552B2 patent drawing
  • US10713552B2 patent drawing

AI summary

An RFID tag manufacturing method is provided that includes arranging a plurality of RFIC elements in a housing tool at a first arrangement density; and extracting an RFIC element group out of the plurality of RFIC elements arranged in the housing tool. Moreover, the extracted RFIC element group has a second arrangement density that is lower than the first arrangement density and that corresponds to an arrangement density of a plurality of antenna patterns arranged on an antenna substrate. The method includes disposing the RFIC element group onto the plurality of antenna patterns of the antenna substrate while maintaining the second arrangement density.