RFIC Tag Reinforcing Layer Stress Distribution

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Solution Overview

Problem

Existing radio communication tags for linen products, such as those described in Japanese Patent Laying-Open No. 2012-18629, suffer from discomfort due to the height of the covered RFIC portion and potential breakage during cleaning, especially when exposed to solvents.

Innovation Solution

A radio communication tag with a flexible base sheet, a reinforcing layer on one surface, and an RFIC element on the other, where the RFIC element is surrounded by a circular reinforcing layer in plan view, alleviating stress concentration and making breakage prevention and identification easier.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the RFIC chip is covered with resin to protect against stress and solvent, then the RFIC chip is protected, but the covered portion has great height causing user discomfort and potential swelling during cleaning

Engineering Contradiction:
Improveprotection of RFIC chipVSAvoiduser comfort
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent divides the protective structure into two separate layers: a reinforcing layer on the front surface and a sealing layer on the back surface. This segmentation allows each layer to perform its specific function without the drawbacks of a single thick covering - the reinforcing layer provides structural support without height, and the sealing layer protects against solvents without causing swelling.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies different material properties to different locations: the reinforcing layer has high rigidity to resist stress, while the sealing layer has chemical resistance to protect against solvents. This local differentiation of material properties allows optimal protection at each location without compromising overall performance or user comfort.

Inventive Principle:
Principle #3Local quality

2Strength

If the RFIC chip is covered with resin to protect against stress, then the RFIC chip is protected, but the covered portion may swell during cleaning causing connected portion to break

Engineering Contradiction:
Improvestress resistanceVSAvoidconnection stability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The protective structure is segmented into a reinforcing layer for stress resistance and a sealing layer for chemical protection. This prevents the swelling issue by using a thin sealing layer that doesn't absorb solvents, while the reinforcing layer handles stress without requiring thickness.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses a composite structure combining a reinforcing layer and a sealing layer with different material properties. The reinforcing layer provides mechanical strength, while the sealing layer provides chemical resistance without causing swelling, creating a composite protective system that avoids the drawbacks of single-material solutions.

Inventive Principle:
Principle #40Composite materials

3Reliability

If a reinforcing layer is added to reduce stress concentration, then breakage is prevented, but the device complexity increases

Engineering Contradiction:
Improvebreakage preventionVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the reinforcing layer and sealing layer into a unified protective structure where both layers work together. The circular reinforcing layer is integrated with the rectangular sealing layer to form a cohesive protection system that prevents breakage without requiring additional complex components or assembly steps.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS9582747B2Radio communication tag and method for manufacturing the same
Publication Date: 2017.02.28 MURATA MFG CO LTD
  • US9582747B2 patent drawing
  • US9582747B2 patent drawing
  • US9582747B2 patent drawing

AI summary

An antenna conductor and a reinforcing layer are provided on an upper surface and a lower surface, respectively, of a flexible base film. An RFIC element is mounted on the upper surface of the base film. Two I/O terminals provided on the RFIC element are each connected to meander patterns of the antenna conductor. In a plan view, the reinforcing layer has a circular contour, and the RFIC element is surrounded by the contour of the reinforcing layer. The two I/O terminals provided on the RFIC element are exposed on the upper surface of the base film. Breakage of the connected portion between the RFIC element and the antenna conductor is prevented, and any breakage that has occurred is easily identified.