RFIC Device Through-Hole Resin Flow Injection Molding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
RFID tags face issues during injection molding, such as resin-absent cavities and misalignment due to the blocking of resin flow and thermal damage to the RFIC chip, which can be exacerbated by the use of heat-resistant sheets intended to protect the chip.
Innovation Solution
An RFIC device with a resin block featuring a through-hole penetrating its surfaces, allowing molding resin to flow through and embedding the RFIC element and coil antenna, which maintains communication properties and prevents damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a heat-resistant laminated sheet is used to protect the RFIC chip from resin heat, then the chip is protected from thermal damage, but the sheet hinders resin flow causing resin-absent cavities and may move the tag from its predetermined position
Solution Approach 1:
The invention removes the heat-resistant laminated sheet from the RFID tag structure. Instead of protecting the chip with a sheet that blocks resin flow, the chip is directly embedded in the resin block, allowing resin to flow freely and fill all cavities while still protecting the chip from thermal damage through the inherent properties of the embedding process
Solution Approach 2:
The resin block itself serves as the intermediary that protects the RFIC chip from thermal damage. By embedding the chip directly in the resin without an additional heat-resistant sheet, the resin acts as both the protective medium and the flowing material that fills the mold cavity completely
2Device complexity
If the RFID tag is disposed with its large surface directly facing the resin flow, then the tag structure is simplified, but the possibility of RFIC chip damage increases due to direct exposure to hot resin flow
Solution Approach 1:
The invention changes the thermal parameters of the resin by allowing it to cool and solidify as it fills the mold cavity. The resin transitions from a hot, flowing state that could damage the chip to a cooling, solidifying state that protects the chip, thereby changing the thermal condition from harmful to protective
3Stability of the object's composition
If the RFID tag is embedded in the commodity by injection molding, then the tag becomes integrated with the commodity, but resin flow may be blocked causing resin-absent cavities and the tag may be misaligned
Solution Approach 1:
The invention segments the mold cavity into regions around the embedded RFID tag, allowing resin to flow from multiple directions and paths. The through-hole structure and strategic placement of injection gates enable resin to navigate around the tag rather than being blocked by it, ensuring complete filling while maintaining tag alignment
Data Source
AI summary
An RFIC device including a resin block having a first surface, a second surface that faces the first surface, and a through-hole that extends through the first surface and the second surface. Moreover, the RFIC device includes an RFIC element that is embedded in the resin block and a coil antenna disposed in the resin block that is connected with the RFIC element and that has a central axis that extends from the first surface to the second surface. In addition, the through-hole extends inside the coil antenna.