Passive RFID Tag Antenna Structure for High-Temperature Reliability
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Solution Overview
Problem
Passive RFID tags degrade and experience peeling in high temperature environments due to material properties and structural instability, affecting electrical performance and reliability.
Innovation Solution
A passive RFID tag design featuring a metal antenna with mirror symmetry on opposite surfaces, adjustable length, and a radio frequency chip embedded in the antenna, allowing for flexible impedance matching and improved structural integrity in high temperature conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silver paste is used as conductive medium on ceramic surface, then electrical connection is achieved, but peeling occurs in repeated high temperature application environments
Solution Approach 1:
The patent uses copper foil as conductive medium instead of silver paste, and combines it with high-temperature-resistant substrate materials. This material substitution and composite structure prevent peeling in high-temperature environments while maintaining electrical connection stability.
Solution Approach 2:
The patent changes the sintering temperature parameter from ultra-high temperature (above 800°C) to a lower range (600-750°C), which prevents the peeling of conductive medium while still achieving proper bonding and electrical performance.
2Ease of manufacture
If ultra-high temperature sintering process is used for ceramic dielectrics, then manufacturing is achieved, but conductive medium peeling occurs in repeated high temperature applications
Solution Approach 1:
The patent reduces the sintering temperature from above 800°C to 600-750°C, which maintains manufacturing feasibility while significantly improving high-temperature resistance and preventing conductive medium peeling in repeated applications.
3Ease of manufacture
If PCB FR4 substrate is used, then manufacturing is simplified, but layer peeling and copper foil detachment occur in high temperature environments above 100°C
Solution Approach 1:
The patent replaces PCB FR4 substrate with high-temperature-resistant ceramic or glass fiber reinforced plastic substrates. This material substitution maintains ease of manufacture while ensuring layer stability and preventing copper foil detachment in high-temperature environments above 100°C.
4Ease of manufacture
If PET material is used for substrate, then cost is reduced, but high temperature resistance is poor in long-time high temperature environments
Solution Approach 1:
The patent replaces PET material with high-temperature-resistant ceramic or glass fiber reinforced plastic substrates. This substitution maintains manufacturing simplicity while providing excellent high-temperature resistance for long-time operation in elevated temperature environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances reliability and durability of RFID tags in extreme temperatures by preventing conductive medium deterioration and maximizing antenna area, ensuring stable electrical connections and efficient signal transmission.
Implementation Method 1
a RF chip, embedded in the metal antenna for transmitting and receiving a radio signal in a UHF frequency band through the metal antenna
Data Source
AI summary
A passive radio frequency identification (RFID) tag, including: a carrier; metal antennas, respectively disposed in mirror symmetry on a first surface and a second surface of the carrier opposite to each other, wherein a part of the metal antenna on the first surface and another part of the metal antenna on the second surface are open-circuited at one end of the carrier and short-circuited at another end of the carrier; and a RF chip, embedded in the metal antenna for transmitting and receiving a radio signal in a UHF frequency band through the metal antenna, wherein the RF chip is bonded to a PCB module. The solution of the disclosure overcomes phenomenon of deterioration and peeling of a conductive medium forming a radio frequency radiation structure, and significantly improves reliability of the passive RFID tag used in exposure to a high temperature environment for a long time.