RFID Block Embedded in IC for Wireless Test Data Tracking

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Solution Overview

Problem

The semiconductor industry faces challenges in efficiently and cost-effectively managing information throughout the manufacturing process of integrated circuits (ICs), particularly in recording and retrieving test results at various stages, which hampers efficiency and yield improvement.

Innovation Solution

Incorporating a high capacitance solid state circuit region with a FeRAM-based RFID block and an antenna in ICs for wireless data storage and retrieval, enabling efficient tracking and management of test results and tracking information across different stages of manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If RFID block and antenna are integrated into IC, then wireless data access and tracking efficiency are improved, but device complexity and manufacturing cost increase

Engineering Contradiction:
Improvetracking efficiencyVSAvoidIC structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent combines the RFID block, FeRAM memory, and antenna into a single integrated circuit package. The RFID block includes a FeRAM block for data storage and an analog block with demodulator and modulator circuits, all integrated with the antenna structure on the same IC substrate, enabling wireless communication functionality to be merged with the main IC operations.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The IC is designed to serve multiple functions: it performs its primary high capacitance solid state circuit operations while simultaneously providing RFID wireless communication capabilities. The FeRAM block can store both RFID identification data and test results, making the memory structure multi-functional for both tracking and quality control purposes.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If FeRAM block is used for data storage, then data retention and wireless identification capability are improved, but manufacturing cost increases

Engineering Contradiction:
Improvedata retentionVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent employs FeRAM (Ferroelectric RAM) technology which utilizes ferroelectric material properties to achieve non-volatile data storage with high retention characteristics. The FeRAM block changes its electrical parameters through ferroelectric polarization states to store data reliably without power, providing improved data retention compared to conventional volatile memory.

Inventive Principle:
Principle #35Parameter changes

3Productivity

If test results are recorded and continuously updated at each manufacturing stage, then operational efficiency and yield improvement are improved, but information management complexity increases

Engineering Contradiction:
Improveoperational efficiencyVSAvoidinformation management
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The IC performs self-identification and self-reporting of its test results through the integrated RFID block. The FeRAM memory automatically stores test data from various manufacturing stages, and the RFID antenna enables automatic wireless retrieval of this information without requiring external manual recording systems, thus simplifying information management while improving efficiency.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS8322626B2Integrated circuit with embedded RFID
Publication Date: 2012.12.04 SK HYNIX INC
  • US8322626B2 patent drawing
  • US8322626B2 patent drawing
  • US8322626B2 patent drawing

AI summary

An integrated circuit (IC) die includes a high capacitance solid state circuit region configured to perform predetermined operations and an RFID block configured for wireless communication with an external source. The RFID block is configured to record results from a plurality of stages of a manufacturing process. The RFID block is further configured to generate an internal BIST command in response to an external command wirelessly received by the RFID. The integrated circuit die also includes a built-in self-test (BIST) block coupled to carry out testing of the high capacitance solid state circuit region in response to the internal BIST command. The RFID block is configured to be capable of storing store information relating to the testing. The RFID block is further configured to enable wireless retrieval of the test results from the testing of the high capacitance solid state circuit region.