RFID Module Capacitance Pattern for Lower Resonance Frequency

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Solution Overview

Problem

Conventional RFID modules face challenges in lowering resonance frequency without increasing size, particularly when operating in low frequency bands, and adding components like capacitors or coils to achieve this often necessitates larger module dimensions.

Innovation Solution

The RFID module design incorporates a substrate with a coil conductor featuring a plurality of coil elements arranged in a row, connected by a first conductor pattern, and includes a first electrode within the substrate to form a capacitance pattern, which reduces resonance frequency without enlarging the module by utilizing existing space efficiently.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a capacitor or coil is added to lower the resonance frequency, then the resonance frequency is reduced, but the module size increases

Engineering Contradiction:
Improveresonance frequencyVSAvoidmodule size
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges the capacitor function with the existing substrate structure by forming a capacitance pattern using conductive patterns on the substrate surface. Instead of adding a separate capacitor component, the substrate itself is designed to provide the necessary capacitance, thereby lowering the resonance frequency without increasing module size.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The substrate is designed to serve multiple functions: it provides mechanical support, electrical insulation, and capacitance for resonance frequency adjustment. By making the substrate multi-functional, the patent eliminates the need for separate capacitor components, thus maintaining compact module dimensions while achieving the desired resonance frequency.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If the coil or capacitor size is increased to lower resonance frequency, then the resonance frequency decreases, but the device complexity increases

Engineering Contradiction:
Improveresonance frequencyVSAvoidmodule structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the capacitance function into the substrate's conductive patterns, eliminating the need for separate capacitor components. This integration simplifies the overall module structure while achieving resonance frequency control.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The substrate serves itself by providing both structural support and electrical capacitance functions. The conductive patterns on the substrate automatically provide the necessary capacitance for resonance frequency adjustment without requiring additional components or complex circuitry.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design allows for a reduction in resonance frequency without increasing module size, enables easy adjustment of resonance frequency through electrode sizing, and enhances substrate rigidity while maintaining compact dimensions.

Implementation Method 1

a first electrode within the substrate. The first electrode faces the second land electrode to form a capacitance pattern

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS12537286B2RFID module
Publication Date: 2026.01.27 MURATA MFG CO LTD
  • US12537286B2 patent drawing
  • US12537286B2 patent drawing
  • US12537286B2 patent drawing

AI summary

An RFID module is provided that includes a substrate; first and second land electrodes on a first main surface of the substrate; an RFIC chip having terminals connected to the first and second land electrodes; a coil conductor on the first main surface of the substrate; and a first electrode within the substrate. The first electrode faces the second land electrode to form a capacitance pattern and is connected to the first land electrode via a first interlayer connection conductor. The second land electrode is electrically connected to a first end of the coil conductor, while the first electrode is electrically connected to the second end of the coil conductor.