RFID Carrier Tape Ultrasonic Bonding for Flexible Antennas
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Solution Overview
Problem
Conventional methods for connecting RFIC elements to antenna elements in RFID tags, such as heating and melting solder or ultrasonic bonding, face issues like high heat requirements, long processing times, and stress concentration leading to potential destruction of the connection, especially when using flexible antenna base materials like polyethylene terephthalate (PET).
Innovation Solution
A carrier tape with housing holes and adhesive seal materials is used to house and separate RFIC elements, allowing them to be affixed to an antenna base material without direct fixation methods like ultrasonic bonding, ensuring stable electrical contact and reducing stress on the connection points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heating and melting solder or conductive adhesive is used to connect RFIC element and antenna element, then electrical connection is achieved, but high heat resistance material is required and manufacturing cost increases
Solution Approach 1:
The patent replaces thermal bonding methods (heating and melting solder or conductive adhesive) with ultrasonic bonding, which uses mechanical vibration energy to join the RFIC element and antenna element. This substitution eliminates the need for high heat resistance materials and reduces manufacturing costs while maintaining reliable electrical connection.
Solution Approach 2:
The patent changes the bonding parameter from thermal (temperature-based) to mechanical (vibration-based). By using ultrasonic vibration instead of heat, the process can be applied to flexible materials like PET without requiring high heat resistance, thus reducing material cost and simplifying manufacturing.
2Ease of manufacture
If ultrasonic bonding is used to connect RFIC element and antenna element, then manufacturing cost is reduced, but processing time increases and material quality changes at high temperature
Solution Approach 1:
The patent applies periodic ultrasonic vibration to the bonding interface between RFIC element and antenna element. This periodic mechanical action enables bonding without sustained high temperature, reducing processing time and avoiding quality degradation of flexible materials like PET, while maintaining cost-effectiveness.
3Adaptability or versatility
If flexible antenna base material is used to improve adaptability, then RFID tag can be affixed to curved surfaces, but connection part is vulnerable to stress and destruction
Solution Approach 1:
The patent applies ultrasonic bonding to create a strong, stress-resistant connection between the RFIC element and flexible antenna element before the RFID tag is subjected to bending or mechanical stress. This pre-bonding with ultrasonic energy provides cushioning against future stress, preventing connection destruction even when the flexible material is bent or deformed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves handleability and reduces manufacturing costs by eliminating the need for additional retention members and shortening manufacturing steps, while maintaining reliable electrical connections even when the antenna base material is bent.
Implementation Method 1
a plurality of seal materials 4 each having an adhesive layer 4a on one principal surface and affixed to the second principal surface 3b of the tape-shaped main body 3 such that the adhesive layer is exposed in at least a portion of each of the housing holes 3c
Data Source
Figure 1~2
Figure 3~4C
Figure 4D~4G
AI summary
A method for manufacturing a carrier tape housing a plurality of electronic components with seal materials according to the present invention comprises, forming housing holes in tape-shaped main body having first principal surface and second principal surface along longitudinal direction of the tape-shaped main body, the housing holes penetrating from first principal surface to second principal surface, affixing adhesive layer of tape-shaped seal material to second principal surface of the tape-shaped main body to cover the housing holes, forming cuts in the tape-shaped seal material to separate portions serving as the seal materials including portions at least partially overlapping with the respective housing holes in a planar view from the other portions, and housing chip-shaped electronic component into each of the housing holes of the tape-shaped main body and fixing the electronic component to the adhesive layer of the seal material exposed in each of the housing holes.