RFID Chip Reactive Coupling via Dielectric Barrier
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Solution Overview
Problem
RFID tags with printed semiconductor materials, such as polyaniline and amorphous silicon, are prone to degradation due to moisture and oxygen ingress, which affects their performance.
Innovation Solution
A radio-frequency identification (RFID) device with a printed electronic circuit (PEC) coupled to an antenna via reactive means, using a dielectric or protective coating layer to prevent moisture and oxygen ingress, allowing capacitive or inductive coupling without conductive connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive adhesive or conductive connection is used to couple the PEC to the antenna, then electrical connection is achieved, but the lower side of the PEC cannot be fully covered with a barrier layer, allowing moisture and oxygen ingress
Solution Approach 1:
A dielectric layer is introduced as an intermediary between the PEC and the antenna, enabling capacitive coupling while allowing the barrier layer to fully cover the lower side of the PEC. This mediator resolves the contradiction by providing both electrical coupling functionality and environmental protection.
Solution Approach 2:
The patent replaces conductive adhesive connections with reactive coupling mechanisms (capacitive or inductive coupling). This substitution eliminates the need for conductive pathways that would compromise the barrier layer, allowing full coverage for environmental protection while maintaining electrical functionality through field-based coupling.
2Object-affected harmful factors
If a barrier layer is applied to protect the PEC from environmental factors, then protection against moisture and oxygen is improved, but electrical connection to the antenna is compromised
Solution Approach 1:
The dielectric layer serves as a mediator that enables capacitive coupling between the PEC and antenna while maintaining the integrity of the barrier layer. This intermediary structure allows the barrier layer to fully protect the PEC without compromising electrical connection stability.
Solution Approach 2:
The patent changes the coupling mechanism from conductive to reactive (capacitive or inductive), altering the electrical connection parameters. This parameter change allows the barrier layer to provide full environmental protection while maintaining reliable electrical connection through field-based interaction.
3Ease of manufacture
If conductive adhesive is used to attach the PEC to the antenna, then ease of manufacture is improved, but the lower side of the PEC remains exposed to environmental factors
Solution Approach 1:
The dielectric layer acts as an intermediary attachment layer between the PEC and antenna, simplifying the manufacturing process by providing a ready-made interface while simultaneously enabling full barrier layer coverage to prevent environmental ingress.
Solution Approach 2:
The patent replaces conductive adhesive attachment with reactive coupling through a dielectric layer. This substitution maintains ease of manufacture by providing a straightforward lamination process while enabling complete barrier layer coverage for environmental protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects the PEC from environmental degradation, ensuring reliable operation of the RFID device by fully covering the lower side with a barrier layer, thus maintaining performance across various frequencies.
Implementation Method 1
the printed electronic circuit comprises a printed RFID chip and at least two conductor pads, wherein the at least two conductor pads of the PEC are capacitively and/or inductively coupled to the conductive layer
Implementation Method 2
the printed electronic circuit comprises a printed RFID chip and at least two conductor pads, wherein the at least two conductor pads of the PEC are capacitively and/or inductively coupled to the conductive layer
Implementation Method 3
a protective coating layer disposed over at least a portion of the dielectric layer... such that the protective coating layer fully covers the lower side of the PEC to protect against oxygen and moisture ingress
Data Source
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AI summary
An RFID device using a printed electronic circuit (PEC) is disclosed. The PEC or electronic circuit which includes printed elements is coupled to a conductor structure, such as an antenna, by reactive means, such as an electric field, a magnetic field, or a combination of both. The RFID device comprises a base layer and a conductive layer (antenna structure) disposed over the base layer. A dielectric layer is then disposed over at least a portion of the conductive layer. A barrier layer is then disposed over the dielectric layer and fully covers the PEC to protect against oxygen and moisture ingress. Further, the PEC is typically attached to a carrier or strap to facilitate coupling between the antenna structure and PEC. In another embodiment, the barrier layer can be replaced with an adhesive layer that acts as both the barrier layer and the dielectric layer.