RFID Inlay IC Chip Mounting with Staged UV Adhesive Curing
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Solution Overview
Problem
IC chips are unstable on adhesives during the manufacturing process of RFID inlays due to low viscosity, leading to potential shifting or tilting, which affects the accuracy of their mounting position.
Innovation Solution
An IC chip mounting apparatus that includes a conveyor, an ejection unit, an IC chip placement unit, a first light irradiator, and a second light irradiator to accurately place and fix IC chips on antennas using thermosetting adhesives, with controlled ultraviolet light irradiation to adjust viscosity and enhance mounting precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a photo-curable adhesive is used to mount the IC chip, then the adhesive can be cured to fix the chip, but the adhesive has low viscosity before curing which causes the IC chip to shift or tilt
Solution Approach 1:
A support member is provided in advance at the mounting position to prevent the IC chip from shifting or tilting before the adhesive cures. The support member is removed after curing, having fulfilled its temporary support function during the vulnerable uncured state.
Solution Approach 2:
The support member acts as a cushioning element that anticipates and prevents the harmful effect of chip shifting. By providing this protective structure beforehand, the system ensures the chip remains stable during the critical period when adhesive viscosity is insufficient.
2Ease of operation
If the adhesive viscosity is kept low for easy application, then the adhesive can be evenly distributed, but the IC chip becomes unstable and may shift or tilt
Solution Approach 1:
The support member is positioned in advance at the intended mounting location to counteract the instability caused by low-viscosity adhesive. This allows the adhesive to remain easily applicable while the support member prevents chip displacement during the application and curing process.
Solution Approach 2:
The support member serves as an intermediary element between the low-viscosity adhesive and the IC chip. It mediates the interaction by providing mechanical support that compensates for the adhesive's insufficient holding power during the uncured state.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the accuracy of IC chip positioning on RFID inlays by stabilizing the chips on the adhesive, ensuring precise placement and strong physical and electrical connections.
Implementation Method 1
a first light irradiator that irradiates the adhesive of each antenna with a first light, in the vicinity of a position where an IC chip is located on the conveying surface
Implementation Method 2
a second light irradiator that irradiates the adhesive of each antenna with a second light, at a position downstream from a position where the adhesive is irradiated with the first light
Data Source
AI summary
The present invention is an IC chip mounting apparatus including: a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material; an ejection unit configured to eject a thermosetting adhesive toward a reference position of each antenna in the antenna continuous body; an IC chip placement unit configured to place an IC chip on the adhesive that is located on the reference position of each antenna in the antenna continuous body; a first light irradiator configured to irradiate the adhesive of each antenna with a first light, in the vicinity of a position where an IC chip is located on the conveying surface; and a second light irradiator configured to irradiate the adhesive of each antenna with a second light, at a position downstream from a position where the adhesive is irradiated with the first light.