RFID Circuit Embedded in Bonded Abrasive Wheels
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Solution Overview
Problem
Existing consumable abrasive products, such as bonded abrasive wheels, face challenges including inconsistent inventory management, potential for damage leading to safety issues, improper use resulting in inefficiencies or injuries, and theft. Additionally, there is a need for enhanced data collection and analysis to improve quality and productivity in abrasive processes.
Innovation Solution
The integration of electronic circuitry, such as RFID or NFC circuits, within bonded abrasive wheels allows for communication between the wheels, abrading tools, workpieces, and operating devices. This enables data collection and storage, enhancing safety, quality, and inventory management, while also preventing improper use and theft.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If electronic circuitry is embedded within bonded abrasive wheels, then communication capability and data collection are improved, but device complexity increases
Solution Approach 1:
The electronic circuitry (antenna and integrated circuit) is nested within the bonded abrasive wheel structure, specifically embedded in the bond matrix between abrasive particles. This allows the communication device to be integrated into the existing wheel structure without adding external components, thereby improving data collection capability while minimizing increases in overall device complexity
Solution Approach 2:
The bonded abrasive wheel serves multiple functions: it performs its traditional abrasive function while simultaneously housing communication circuitry for RFID or NFC capabilities. This multi-functionality allows the same structure to provide both mechanical cutting/grinding and wireless communication/data storage functions, addressing information loss prevention while managing device complexity
2Productivity
If electronic circuitry is embedded within bonded abrasive wheels, then inventory management and theft prevention are improved, but manufacturing complexity increases
Solution Approach 1:
The electronic circuitry components (antenna and integrated circuit) are prepared and positioned in advance during the wheel manufacturing process, before the final curing stage. The antenna is formed within the mold cavity and the integrated circuit is attached to the antenna structure prior to inserting the abrasive particles and curing the bond matrix, allowing seamless integration without post-manufacturing modifications
Solution Approach 2:
The manufacturing process embeds the communication components nested within the wheel structure during formation. The antenna is formed in the mold cavity, the integrated circuit is attached to the antenna, and then the abrasive particles and bond matrix are applied around these components, creating a nested structure where the communication device is integrated into the wheel's internal architecture
Data Source
Figure 1
Figure 1A~2
Figure 2A~5
AI summary
A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.