RFID Container Assembly for Harsh-Environment Chip Retention
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Solution Overview
Problem
Existing methods for attaching RFID antennas and IC chips to containers like blood-collecting tubes or test tubes fail to withstand severe environmental conditions, leading to detachment due to environmental incompatibility of the inlay base material.
Innovation Solution
A manufacturing method where the antenna is temporarily attached to a base material with a first adhesive, an IC chip is fixed to the antenna, and a partial region of the base material covering the IC chip is left on the container's surface after separation from the base material sheet, ensuring direct attachment to the container.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional RFID tag with separate antenna and IC components is used, then the tag can be manufactured using existing processes, but the tag becomes vulnerable to theft and counterfeiting and lacks durability in harsh environments
Solution Approach 1:
The patent merges the antenna and IC components into a single integrated RFID tag structure. The antenna pattern is formed directly within the substrate along with the IC, eliminating the need for separate antenna components and improving reliability through integration while maintaining manufacturability through existing PCB processes.
Solution Approach 2:
The patent uses a composite substrate structure combining FR4 material with copper traces to form both the antenna and support structure. This composite approach enables the antenna pattern to be formed using standard PCB manufacturing processes while providing durability and security against tampering.
2Reliability
If an RFID tag is designed with high security features and integrated structure, then theft and counterfeiting are prevented, but manufacturing cost and process complexity increase
Solution Approach 1:
The antenna and IC are merged into a single integrated structure that can be manufactured using conventional PCB processes. This integration maintains security and durability while reducing manufacturing costs by eliminating the need for separate antenna components and assembly steps.
Solution Approach 2:
The patent changes the physical parameters of the substrate to achieve both security and manufacturability. By using standard FR4 material with copper traces and forming the antenna pattern through standard PCB routing, the design achieves high reliability while maintaining ease of manufacture through parameter optimization rather than requiring exotic materials or processes.
3Ease of manufacture
If the RFID tag uses a simple antenna structure, then manufacturing is easier, but the tag cannot provide sufficient security against theft and counterfeiting
Solution Approach 1:
The integration of antenna and IC into a single structure simplifies manufacturing by eliminating separate antenna assembly steps while maintaining security through the integrated design that prevents easy removal or tampering of critical components.
Solution Approach 2:
The composite substrate structure using FR4 and copper provides both manufacturing simplicity through standard PCB processes and security through the integrated, tamper-resistant design that combines antenna and IC in a single durable structure.
Data Source
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AI summary
A manufacturing method for an RFID container having an antenna and an IC chip, including: a process of temporarily attaching the antenna to a base material by a first adhesive; a process of fixing the IC chip to the antenna; a process of attaching a front surface of the container and a surface of the base material on which the antenna is formed by a second adhesive; and a process of removing, while leaving a partial region of the base material covering the IC chip on the front surface of the container, a region of the base material other than the partial region covering the IC chip from the container.