RFID Device Dual Injection Molding Waterproofing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional RFID devices face high manufacturing costs and poor waterproofing due to complex antenna formation methods, such as copper antennas requiring multiple turns for HF or UHF operation and the need for waterproof gel and sonic pressing in PCB-based structures.
Innovation Solution
An RFID device with a flexible antenna film wrapped around a base material, encapsulated between two housings formed by dual injection molding, featuring a protection layer for high-temperature resistance and an adhesive layer to prevent deformation during molding, ensuring airtight and high-temperature-resistant capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper antenna is formed by multiple turns to reach HF or UHF operation frequency, then the antenna can operate at required frequencies, but the manufacturing cost increases
Solution Approach 1:
The patent changes the antenna structure from traditional multi-turn copper winding to a planar spiral trace pattern on PCB. This parameter change in geometry and material configuration achieves the same RF performance (HF/UHF operation) while dramatically simplifying manufacturing and reducing cost.
Solution Approach 2:
The patent replaces the mechanical copper winding process with a printed circuit board trace system. The antenna function is achieved through conductive traces printed or etched on PCB substrate, eliminating the need for manual or automated wire winding operations.
2Reliability
If PCB is encapsulated inside housing with waterproof gel and supersonic pressing process, then the device can achieve waterproofing, but the manufacturing cost increases and waterproof effect is poor
Solution Approach 1:
The patent merges the antenna, RFID chip, and PCB into a single integrated assembly before housing encapsulation. This unified structure eliminates the need for additional waterproofing materials and complex pressing processes, achieving both cost reduction and improved waterproof reliability.
Solution Approach 2:
The patent extracts and eliminates the waterproof gel and supersonic pressing process from the manufacturing sequence. Instead of adding complex waterproofing steps, the design achieves waterproofing through proper housing sealing and integrated component placement.
3Shape
If antenna is formed around peripheral of substrate, then the antenna structure can be created, but the manufacturing complexity increases
Solution Approach 1:
The patent transitions the antenna from a three-dimensional peripheral structure to a two-dimensional planar spiral pattern on the PCB surface. This dimensional simplification maintains the required inductive reactance while dramatically reducing manufacturing complexity.
Data Source
AI summary
The present invention provides an RFID device and manufacturing method. The RFID device comprises a first housing, an antenna module, and a second housing. The antenna module arranged on the first housing comprises a base substrate, and an antenna layer, sticking on an outer surface of the base substrate. The second housing is formed to couple to the first housing by an injection molding process so that the antenna module is arranged between the first and second housings.