RFID Device Flexible Antenna Hot Pressing Bonding
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Solution Overview
Problem
Conventional RFID devices face increased manufacturing costs and bulkiness due to the need for high-temperature resistant substrates to withstand reflow soldering processes, which also complicates the electrical connection between substrate and antenna modules.
Innovation Solution
The use of a flexible antenna module substrate connected to a substrate module with RFID chipset and passive components via conductive adhesive and a hot pressing process, eliminating reflow soldering and simplifying the electrical connection by avoiding antenna coils between connecting pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If reflow soldering process is used to electrically bond substrate module and antenna module, then reliable electrical connection is achieved, but high-temperature resistant substrates are required which increases manufacturing cost and device bulk volume
Solution Approach 1:
The patent changes the temperature parameter of the bonding process from high-temperature reflow soldering to low-temperature hot pressing (below 150°C). This allows the use of flexible substrates instead of expensive high-temperature resistant substrates like PCB, thereby reducing manufacturing cost while maintaining electrical connection reliability through conductive adhesive bonding
Solution Approach 2:
The patent replaces the thermal-mechanical reflow soldering process with a mechanical hot pressing process combined with conductive adhesive. Instead of using high-temperature thermal fields to melt and bond components, the invention uses controlled mechanical pressure and lower temperature to activate conductive adhesive, achieving reliable electrical bonding without requiring expensive high-temperature substrates
2Reliability
If high-temperature resistant substrates are used to withstand reflow process, then substrate and antenna module are protected from heat damage, but device weight and package volume increase
Solution Approach 1:
The patent changes the temperature parameter of the bonding process to below 150°C, which is compatible with flexible substrates. This eliminates the need for heavy, rigid high-temperature resistant substrates while still protecting the antenna module and substrate from heat damage through controlled low-temperature hot pressing
Solution Approach 2:
The patent employs flexible substrates that can be made thin and light, replacing traditional rigid PCB substrates. These flexible substrates are sufficient to withstand the reduced temperature hot pressing process, thereby reducing device weight and package volume while maintaining structural integrity and heat protection
3Reliability
If antenna coil is routed between electrical connecting pads on flexible substrate, then complete antenna circuit is formed, but circuit layout becomes complicated increasing manufacturing complexity
Solution Approach 1:
The patent applies local quality by creating an antenna-free zone between the electrical connecting pads on the flexible substrate. In this specific local area, the substrate does not contain antenna coil traces, allowing straightforward pad-to-pad electrical connections. The antenna circuit is routed in other areas of the substrate, maintaining completeness while simplifying the critical connection region
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, minimizes the weight and volume of the RFID device, and simplifies the connection process, enabling integration with external devices for near-field communication applications.
Implementation Method 1
conductive adhesive and hot pressing process
Implementation Method 2
conductive adhesives are respectively embedded between each corresponding third and first electrical connecting pads, and third and second electrical connecting pads
Implementation Method 3
Radio frequency identification (RFID) is a wireless communication technology, an integration of wireless information processing technology, read/write module, and RFID device
Data Source
AI summary
The present invention provides a radio frequency identification device comprising an antenna module and a substrate module. The antenna module has a flexible substrate having an antenna circuit forming thereon. A first surface of the flexible substrate further has a first and a second electrical connecting pads coupled to the antenna circuit, wherein the antenna circuit does not pass through a space between the first and second electrical connecting pads. The substrate module comprises a RFID chip and at least one passive element electrically coupled to a substrate having a pair of third electrical connecting pads. A conductive adhesive formed between the first and second electrical connecting pads and the third electrical connecting pads is utilized to couple the antenna module with the substrate module.