RFID-Embedded Hoses and Pipes Without Mechanical Property Loss

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Solution Overview

Problem

Existing methods for embedding RFID chips in hoses and pipes are inefficient, prone to damage, and affect the mechanical properties of the product, while also requiring additional components and steps, which complicates the manufacturing process.

Innovation Solution

Conductive structures of predetermined geometry are applied to the outer surface of hose or pipe blanks, with RFID chips placed on these structures to form an electrically conductive connection, and then vulcanized or cured together, allowing for flexible placement and easy integration without additional thread materials or complex winding devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If RFID chips are mounted on carrier material labels or strips and attached to the outside of the hose, then RFID identification is achieved, but additional effort is required and there is risk of loss or damage

Engineering Contradiction:
ImproveRFID chip retentionVSAvoidManufacturing effort
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the RFID chip mounting process with the hose manufacturing process itself. The RFID chips are placed on the hose during vulcanization, integrating two previously separate operations (hose manufacturing and RFID attachment) into one unified process, thereby eliminating additional manufacturing effort while ensuring reliable retention through the vulcanization bond

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If RFID chips on carrier material strips are wound or spirally applied around the plastic tube, then RFID identification is achieved, but a corresponding winding device is required and RFID thread consumption is high

Engineering Contradiction:
ImproveRFID chip retentionVSAvoidWinding device complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the RFID chip placement operation from the complex spiral winding process. Instead of requiring a dedicated winding device to spiral apply RFID threads, the invention places individual RFID chips directly onto the hose at specific locations during vulcanization, eliminating the need for specialized winding equipment while maintaining reliable retention through the vulcanization process

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of manufacture

If conventional RFID chips on carrier material are integrated into the hose during manufacturing, then RFID identification is achieved, but delamination of layers occurs leading to hose failure

Engineering Contradiction:
ImproveIntegration during manufacturingVSAvoidHose structural integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent uses the conductive structure as a template or pattern that is printed onto the hose surface. This conductive pattern serves as a guide for placing the RFID chips, ensuring proper positioning without requiring physical integration of carrier materials that could cause delamination. The conductive structure is merely a marking guide, not a physical substrate that compromises hose integrity

Inventive Principle:
Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for efficient embedding of RFID chips without compromising mechanical properties, reducing effort and risk of damage, and enabling continuous production with precise placement of RFID chips in each section.

Implementation Method 1

the conductive structures are printed using an electrically conductive ink

Methodology Applied
Scientific EffectConductive ink printing: Deposition (physical)

Implementation Method 2

the hose or pipe blank with the conductive structures and the attached RFID chips is vulcanized or cured together

Methodology Applied
Scientific EffectVulcanization: Chemical Bonding

Data Source

PatentEP4113359B1Method for manufacturing tubing and pipelines with RFID chips
Publication Date: 2024.10.23 CONTITECH TECHNO CHEMIE GMBH
  • EP4113359B1 patent drawingFigure 1

AI summary

The invention relates to a method for manufacturing hoses and pipes with RFID chips (5). The object of the invention is to further develop the known methods for embedding RFID chips (5) in hoses and pipes in such a way that the embedding is possible without significant influence on the mechanical properties of the product and with minimal effort.This task is solved by applying electrically conductive structures (4) of predetermined geometry to the outer surface of a hose or pipe blank (1) at predetermined axial intervals, and placing an RFID chip (5) on each of these electrically conductive structures (4), whereby the RFID chips (5) come into electrically conductive contact with the respective electrically conductive structure (4), and the hose or pipe blank (1) with the applied electrically conductive structures (4) and the attached RFID chips (5) is vulcanized or cured together and subsequently cut into sections of predetermined length.