RFID IC Surface Layout for Clean Adhesive Attachment After Plasma Dicing
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Solution Overview
Problem
Plasma etching during the dicing of RFID ICs can deposit fluoropolymer on IC surfaces, preventing adhesion to tag substrates or inlays, which leads to failed tag assembly or reduced shear strength.
Innovation Solution
Incorporating specific surface areas on the RFID IC, such as oxide or nitride surfaces, from which fluoropolymer can be easily removed, and excluding metal or organic repassivation layers, to facilitate subsequent adhesive attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If plasma etching is used to dice RFID ICs, then dicing efficiency and precision are improved, but fluoropolymer deposits on IC surfaces preventing adhesion to tag substrates
Solution Approach 1:
The IC surface is divided into different functional zones: adhesive attachment areas with oxide or nitride surfaces that are easy to clean of fluoropolymer, and metal or organic repassivation areas that retain fluoropolymer for protection. This segmentation allows the IC to simultaneously achieve good adhesion where needed and protection where required.
Solution Approach 2:
Different surface materials are used in different locations on the IC surface. Oxide or nitride surfaces are placed in areas requiring adhesive attachment where fluoropolymer removal is critical, while metal or organic repassivation layers are placed in areas where fluoropolymer retention provides beneficial protection.
2Reliability
If fluoropolymer is removed from IC surfaces to improve adhesion, then adhesive attachment is enhanced, but IC protection and reliability are reduced
Solution Approach 1:
The IC surface is segmented into zones with different fluoropolymer removal characteristics. Oxide or nitride areas are designed for easy fluoropolymer removal to enable reliable adhesive attachment, while metal or organic repassivation areas are designed to retain fluoropolymer for continued IC protection.
Solution Approach 2:
Different surface materials provide different local properties: oxide and nitride surfaces offer fluoropolymer removal capability for adhesion, while metal and organic surfaces offer fluoropolymer retention for protection. Each area is optimized for its specific function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for effective removal of fluoropolymer from designated areas on the RFID IC, improving adhesive adhesion and enhancing the shear strength of assembled tags.
Implementation Method 1
Plasma etching, when used to dice RFID ICs, may deposit fluoropolymer on IC surfaces
Implementation Method 2
adhere to an adhesive for bonding the IC to the inlay
Data Source
AI summary
Plasma etching, when used to dice RFID ICs, may deposit fluoropolymer on IC surfaces, which may prevent IC adhesion to tag substrates or inlays. To address this issue, an RFID IC can include specific surface areas from which fluoropolymer can be relatively easily removed and therefore are suitable for subsequent adhesive attachment. These surface areas may include oxide or nitride surfaces, from which fluoropolymer can be relatively easily removed, and may exclude metal or organic repassivation layers, which cannot be easily cleaned of fluoropolymer. The RFID IC may also include a support structure disposed on an insulating layer and between contact pads to mitigate a deformation of an inlay during mounting of the IC to the inlay. Portions of the insulating layer may be exposed between contact pads to adhere to an adhesive for bonding the IC to the inlay.